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    Transformer Losses and Thermal Design: Modelling and Validation

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    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

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    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

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    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

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    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Bourns MSF series four-terminal current-sense shunt resistor with radial PCB terminals

    Bourns Introduces Four-Terminal Shunt Resistors for Current Sensing

    Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

    Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

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Global Advanced Metals Commissions New Facility to Serve Growing Demand for 3D Printing of Prototype and Commercial Parts

6.12.2021
Reading Time: 1 min read
A A

Waltham, MA and Perth, Australia – DATE – Global Advanced Metals Pty Ltd (GAM), a leading producer of tantalum products, has announced the commissioning of Tekna TEKSPHERO plasma spheroidization equipment at its Boyertown, Pennsylvania, location. The equipment is part of a new process development facility for the manufacture of spherical tantalum and other refractory metal powders for advanced additive manufacturing and metal injection molding.

The equipment produces spherical powders from a variety of tantalum feed materials. Particle sizes range from 10 to 100 microns, in narrow or broad particle size distributions. Standard oxygen content is in the range of 600 to 1000 ppm, but low oxygen (< 250 ppm) powders are an option.

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Andrew O’Donovan, chief executive officer of Global Advanced Metals, said, “Our new process development facility enables us to create spherical tantalum powders that can be used for 3D printing of prototypes and commercial parts. The ability to rapidly prototype and produce complex tantalum parts via additive manufacturing offers designers new materials choices for applications in military, aerospace, medical and other demanding industries.”

GAM has developed relationships with experts in the field of laser and e-beam 3D printing to create prototype and commercial parts. Successful printing of tantalum parts with unique physical properties and complex geometries, including open cellular structures, has been demonstrated.

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