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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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    Exxelia PM film capacitor and passive-component technologies for BepiColombo space electronics

    Exxelia Passive Components Support BepiColombo Mission

    TT Electronics OPI1268T green through-hole phototransistor optocoupler used for optical isolation in power systems.

    Optocoupler Reliability: Designing Optical Isolation for 25-Year Grid Assets

    TDK B43657 and B43658 ultra-compact snap-in aluminum electrolytic capacitors for 500 V DC power-supply and DC-link applications

    TDK Extends Compact Snap-In Capacitors to 500 V for AI Servers

    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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Global Advanced Metals Commissions New Facility to Serve Growing Demand for 3D Printing of Prototype and Commercial Parts

6.12.2021
Reading Time: 1 min read
A A

Waltham, MA and Perth, Australia – DATE – Global Advanced Metals Pty Ltd (GAM), a leading producer of tantalum products, has announced the commissioning of Tekna TEKSPHERO plasma spheroidization equipment at its Boyertown, Pennsylvania, location. The equipment is part of a new process development facility for the manufacture of spherical tantalum and other refractory metal powders for advanced additive manufacturing and metal injection molding.

The equipment produces spherical powders from a variety of tantalum feed materials. Particle sizes range from 10 to 100 microns, in narrow or broad particle size distributions. Standard oxygen content is in the range of 600 to 1000 ppm, but low oxygen (< 250 ppm) powders are an option.

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Andrew O’Donovan, chief executive officer of Global Advanced Metals, said, “Our new process development facility enables us to create spherical tantalum powders that can be used for 3D printing of prototypes and commercial parts. The ability to rapidly prototype and produce complex tantalum parts via additive manufacturing offers designers new materials choices for applications in military, aerospace, medical and other demanding industries.”

GAM has developed relationships with experts in the field of laser and e-beam 3D printing to create prototype and commercial parts. Successful printing of tantalum parts with unique physical properties and complex geometries, including open cellular structures, has been demonstrated.

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