Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Extends Aluminum Capacitors Rating Up to 600 V for DC Links

    Würth Elektronik Introduces Product Navigator for Passive Components

    Panasonic Passive Components for Reliable Robotic Arms

    Littelfuse Unveils Ultra-Low-Power TMR Magnetic Switches

    DC/DC Push‑Pull Converter vs PSFB Design Guide

    Wk 2 Electronics Supply Chain Digest

    Rubycon PMLCAP DC‑Link Film Capacitors in Mass Production

    Bourns SSD‑1000A AEC‑Q Digital Current Sensors

    YAGEO High‑Capacitance X7R Automotive MLCC Extensions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Extends Aluminum Capacitors Rating Up to 600 V for DC Links

    Würth Elektronik Introduces Product Navigator for Passive Components

    Panasonic Passive Components for Reliable Robotic Arms

    Littelfuse Unveils Ultra-Low-Power TMR Magnetic Switches

    DC/DC Push‑Pull Converter vs PSFB Design Guide

    Wk 2 Electronics Supply Chain Digest

    Rubycon PMLCAP DC‑Link Film Capacitors in Mass Production

    Bourns SSD‑1000A AEC‑Q Digital Current Sensors

    YAGEO High‑Capacitance X7R Automotive MLCC Extensions

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Improving High Voltage Power Modules with new Silicon Snubber Capacitor Technology

5.2.2025
Reading Time: 8 mins read
A A
Full paper download

Murata’s new Silicon Snubber Capacitor technology offers solutions for high voltage power modules, enabling them to fully harness the benefits of wide band gap technologies by overcoming the issues they may face.

This paper was presented by Tom Choisy, junior product manager Murata Integrated Passive Solutions, Caen, France at the 4th PCNS 10-14th September 2023, Sønderborg, Denmark as paper No.1.1.

RelatedPosts

Murata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate

Murata Releases World First 15nF 1.25kV C0G MLCC in 1210 Size

Murata Expands High Rel NTC Thermistors in Compact 0603M Size

Automotive Industry Trends

The world is moving towards a “Greener” society. The collective drive to achieve zero-emissions is already affecting the way that energy is produced and consumed. As of today, more than 70 countries have set net-zero targets, covering 76% of global emissions. This brings new market perspectives and new technological trends.

Wide-Bandgap technologies and SiC major adoption leads the way to new opportunities and new requirements. According to Yole study “Power SiC 2022, Market and Technology Report” the acceleration of EV/HEV remains the primary market driver for SiC, especially in the main inverter : “The total power electronic system market, made up of main inverters, DC/DC, and OBC, will grow to ~$26B by 2027, with the main inverter taking more than 60% market share by 2027.” [1]

  1. Market problems to be solved:

With the era of Wide-Bandgap devices in power electronics, the new challenges already on the table will be more pronounced such as:

  1. Higher frequencies
  2. Higher power densities
  3. Higher voltage levels
  4. Better efficiency (lower losses)
  5. Lower inductance
  6. Smaller size
  7. Higher reliability
  8. Higher temperature stability
  9. Easy module integration
  1. Consequences for capacitor requirements:

To meet the new requirements of the automotive power electronics industry, it is essential to develop new capacitor solutions offering:

  1. High voltage performance
  2. High reliability
  3. High temperature stability
  4. High frequency
  5. Ultra-low parasitic inductance
  6. Very small form factor for very close implementation
  7. Compatibility with advanced packaging.

Advanced components to Improve Power Module Efficiency

The automotive industry is moving towards high voltage (800V) electric vehicles, creating a demand for advanced components meeting the requirements listed above. These requirements are driven by the need to maximize overall efficiency of the car and to increase the lifetime of SiC/GaN transistors.

High frequency and high-density components are essential for efficient power conversion, enabling effective energy transfer between the battery and the motor. They facilitate rapid switching, reducing energy losses and improving overall system efficiency. High voltage capabilities are needed to ensure optimal performance. These components need to be highly reliable since they operate in harsh environments but also as small as possible because of the limited space.

New Silicon RC Snubber technology to Improve Power Module Efficiency

Murata Silicon Capacitors Technology

Murata silicon capacitor technology based on 3D structure brings high performance and miniaturisation together thanks to unique structure and stable SiO2 dielectric features.

Silicon Snubber Capacitors

Snubbers are passive components used to address issues linked to rapid switching of power transistors, such as ringing effect. The new innovative technology developed by Murata integrates a resistor and a capacitor inside a single silicon die that reduces the ringing effect caused by the high speed switching of power transistors.

To achieve higher power module efficiency, snubbers need to be placed as close as possible to SiC/GaN transistors. Placing a Silicon Snubber as close as possible to a SiC/GaN will minimize parasitic elements like inductance, which can negatively impact high speed switching performance. By reducing these parasitic effects, Silicon RC Snubbers enable faster and controlled switching, thus improving power conversion efficiency.

Example: R+C Passives inside one die of 3.5 x 3.5mm, with a BV of 1500V, made to fit inside High Voltage Power Modules (SiC 1200V).

Key Features :

  • Ultra low ESL (< 20 pH)
  • 3D structure allows large capacitance value (high density)
  • Low leakage current & Low Loss factor
  • High temperature reliability (Up to 200°C)

Key Benefits :

  • Ringing suppression
  • Maximizes inverter efficiency
  • Can be placed near SiC/GaN transistors
  • Same assembly method as power transistors
  • Reduces EMC interferences

By placing the Si RC Snubber as close as possible to the power transistors, you can limit the ringing effect and fully harness the advantages of SiC as shown in figure below:

Outcomes:

  • Ringing suppression = Higher Inverter Efficiency
  • Potential downsizing of the cooling device
  • Improved battery autonomy & potential downsizing
  • Extended lifetime of SiC transistors
  • EMC reduction = downsizing / lower price for EMC filters
  • No need for high cost & complex assembly (e.g. double sintering) to gain
    inverter efficiency

SUMMARY AND CONCLUSIONS

The integration of Silicon RC Snubbers as close as possible to SiC/GaN power transistors offers several benefits that have a major impact on the overall performance and efficiency of EVs. By eliminating the ringing effect, RC snubbers increase switching speeds, thus improving the overall efficiency of the module and reducing the need for cooling systems. This reduction in cooling devices will contribute to weight and space savings inside the car but also enhances battery autonomy and driving range.

The compatibility of our Silicon RC Snubber technology with the assembly techniques used for SiC/GaN transistors (wirebonding on the top and sintering on the bottom) will eliminate the need for complex assembly processes. This compatibility will also simplify the integration of the component into existing manufacturing lines, allowing manufacturers to use their expertise while benefiting from the increased efficiency provided by the RC Snubber.

By overcoming the issues that can be faced by Wide-Bandgap components, the Silicon RC Snubber enables to fully harness the benefits of these technologies.

REFERENCES

[1] Yole Power Electronics for Automotive – Focus Passenger and Light Commercial Vehicles | Report 2022

Related

Source: EPCI

Recent Posts

Vishay Extends Aluminum Capacitors Rating Up to 600 V for DC Links

15.1.2026
14

Würth Elektronik Introduces Product Navigator for Passive Components

14.1.2026
33

Panasonic Passive Components for Reliable Robotic Arms

14.1.2026
39

Littelfuse Unveils Ultra-Low-Power TMR Magnetic Switches

13.1.2026
15

DC/DC Push‑Pull Converter vs PSFB Design Guide

12.1.2026
45

Rubycon PMLCAP DC‑Link Film Capacitors in Mass Production

9.1.2026
56

Bourns SSD‑1000A AEC‑Q Digital Current Sensors

8.1.2026
45

YAGEO High‑Capacitance X7R Automotive MLCC Extensions

8.1.2026
55

How Metal Prices Are Driving Passive Component Price Hikes

8.1.2026
275

Upcoming Events

Jan 21
18:00 - 18:45 CET

To Rogowski or not to Rogowski

Jan 27
16:00 - 17:00 CET

Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • How Metal Prices Are Driving Passive Component Price Hikes

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version