Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

    Bourns Introduced High-Current Coupled Inductor for 48 V Hybrid and IBC Converters

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Innovative Sintered Pellet Quality Control for Tantalum Capacitors

18.12.2023
Reading Time: 6 mins read
A A

In this article, Vladimir Azbel Ph.D., semiconductor process reliability engineer consultant, Israel suggests control and assessment of tantalum capacitor quality by monitoring its production process, particularly the characteristics of sintered pellets.

The role of methods control in the multi-stage production process of tantalum capacitors

The tantalum capacitor (TC) quality depends on a multi-stage manufacturing process involving several stages, each tightly linked to the preceding one. Accurate control methods are necessary to ensure the reliability of the final product. In certain processes, these methods serve two purposes: maintaining the technological process and monitoring the product’s properties at a given stage, to assess its suitability for the next stage.

RelatedPosts

Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

Mechanical SSC Testing as a Structural Diagnostic Tool for Tantalum Capacitor Anodes

One of the methods used to control the sintering process is to measure the shrinkage of the tantalum anode pellet, which reflects the change in linear dimensions and, accordingly, volume. The shrinkage of a pellet made from the same powder can be used to evaluate the temperature characteristics of the sintering process. At the same time, shrinkage is used as an indicator of the suitability of pellets for the next production stage.  The shrinkage of a pellet made from the same powder can be used to assess the temperature characteristics of the sintering process. Simultaneously, shrinkage is utilized as an indicator of the pellets’ suitability for the next production stage.

While pellet shrinkage reflects volume changes leading to variations in its porous structure, it does not provide details about these changes, such as neck sizes and defects that significantly impact the properties of the final pellet. These properties are crucial for meeting the next stage –formation requirements. Therefore, shrinkage does not offer essential information about the microstructure of the sintered pellet and cannot be used to evaluate its suitability for the next production stage.

The mechanical testing method is suggested for monitoring the elements of the material’s porous structure. This will enable the assessment of their behavior during the sintering process and ensure the necessary properties of the pellets for successful subsequent processing of tantalum capacitors (TC) quality product properties.

The mechanical testing method is advantageous for monitoring the porous structure of sintered pellets.

It is important to note that the sintered pellet, which is the foundation of the TC, is a product of powder metallurgy. Various techniques have been developed to control the porous structure of sintered porous products. Proposed models and mechanisms allow for the control of not only the pore volume but also the average neck size between primary powder particles, and defectiveness in the sintered tantalum pellet. These defects are mostly concentrated within the neck volume. Achieving a specific combination of these parameters allows for creating an acceptable porous structure for the next stage -formation. A mechanical testing method based on Stress-Strain curve registration (see Figure 1.) is suggested to monitor these parameters.

This method’s capabilities enable the assessment of the elements mentioned above of the porous structure in the sintered pellet, by parameters Stress-Strain curve, allowing their control during the current sintering production process and evaluating their acceptability for the subsequent production stage, which does not provide measurement shrinkage.

Experimental methodology

Fig.1 Stress-strain curve and parameters used to describe it

An experiment was conducted to investigate the benefits of using mechanical tests to control the porous structure of a sintered pellet. The researchers selected 10 pellets randomly and measured their size and weight.  Then the volume and density of each pellet and determined the mean and standard deviation of the measurements. The standard deviation was approximately ~1% of the average value by volume, ~1.2% by weight, and ~1.5% by press density.

The pellets were placed in a single crucible sintering oven to reduce the impact of the sintering temperature on shrinkage. After sintering, the researchers measured the linear dimensions and mass of each pellet and calculated its volume and density. To calculate the shrinkage of each pellet, they took the average value of 10 pellets before sintering as its value before sintering.

After determining the shrinkage and density of each of the sintered pellets, they subjected them to mechanical compression tests and recorded their stress-strain curve (see Figure 1. ). From this curve, they determined Ay and calculated n. The measurement accuracy of Ay did not exceed ±5%, taking into account the measurement error of the cross-sectional area of the tablet and the testing machine.

The results of shrinkage, density, Ay, and n for each of the 10 sintered pellets are presented in the figure. (see Figure 2.)

Describe characteristic Strain-Stress curve, porous material

The physical properties of a material: mechanical, electrical, etc. are determined by its structure. The structural elements of a porous material are pores, necks, and defects; and the properties themselves depend on their combination

  1. Yield strength (Ay) depends on the neck’s size, which affects the maximum permissible formation voltage. For porous materials, the yield stress can be calculated using the following equation: Ay = b*A0*(X/D)^2, where b is an empirical constant, Ay is the yield point of the sintered porous material, and A0 is the yield point of the deformed material. The neck size (X) is divided by the size of the primary powder particle (D), but this ratio cannot exceed 0.5.
  2. Young’s modulus (E) is related to porosity, which affects capacitance. The behavior of Young’s modulus of a porous material can be described using the following equation: E = E0 (1-p/pc), where E is the elastic modulus of a porous material with a porosity of the corresponding density p, and E0 is the modulus of solid material at a density pc ~ 1.
  3. The CC curve can be used to calculate the strain hardening coefficient (n), which is related to the defectiveness of the material. This coefficient can influence leakage currents.

Comparative Analysis: Mechanical Control vs. Shrinkage for Sintered Pellet Suitability

The results of shrinkage, density, Ay, and n measurements for 10 pellets after sintering are presented in Fig. 2. From the results, we can conclude the following:

  1. The shrinkage values range from 3.9% to 5.5%, and the standard deviation (STDEV) is approximately 0.6%, within the measurement accuracy.
  2. The values of Ay tend to divide into two groups that differ from each other by approximately 25% to 40%. The measurement error of Au is -5%.
  3. Changes in the values of n show an inverse relationship with Ay. of shrinkage, density, Ay, and n measurements.
Fig.2  Results of measurements of pellets after sintering Shrinkage, Ау, and n, 

Conclusion

The control and assessment of tantalum capacitor quality rely significantly on monitoring the multi-stage production process, particularly the characteristics of sintered pellets. While shrinkage measurements have been conventionally employed, this study underscores their limitations in evaluating crucial microstructural details impacting subsequent stages.

Mechanical testing, particularly Stress-Strain curve analysis, emerges as a promising alternative for scrutinizing elements like neck sizes and defectiveness, which significantly influence the properties of the final pellets.

The comparison between conventional shrinkage measurements and mechanical testing methods, for sintered pellet suitability, revealed significant insights.

Shrinkage, albeit useful to a certain extent, lacks granularity in assessing microstructural aspects crucial for subsequent processing stages.

In contrast, the mechanical testing method, specifically analyzing stress-strain curves, emerges as a superior approach. This method enables precise monitoring and evaluation of crucial parameters like yield strength (Ay) and strain hardening coefficient (n), directly reflecting the influence of microstructural elements, on the material’s properties relevant to reliability TCs.

This suggests that mechanical testing, with its capability to delve deeper into the porous structure, holds promise in augmenting the reliability and quality of tantalum capacitors. Implementing this method enhances monitoring during tantalum capacitor manufacturing, potentially addressing the limitations of traditional assessment approaches.

Related

Source: Vladimir Azbel

Recent Posts

Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

24.6.2026
6

High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

23.6.2026
37

EMC‑Compliant PCB and Connector Design Guidelines

22.6.2026
24

Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

22.6.2026
22

Knowles Expands High‑Q Ceramic Core Inductors for RF designs

19.6.2026
22

TrendForce: CSP in‑house AI ASIC Boom Reshapes Capacitor Demand

18.6.2026
107

Würth Elektroniks Flexible EMI Shielding Sheets Provides Quick and Easy Schielding Solution

17.6.2026
44

Samsung Introduces Automotive 1206 100uF X7T MLCC for Power Rails in ADAS and SoCs

17.6.2026
32

YMIN Hybrid Aluminum Capacitors for Automotive LiDAR Power Rails

17.6.2026
30

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version