Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Compact inductive rotary position encoder sensor near a motor shaft, representing the Vishay RAIK045I MP encoder category

    Vishay Introduces 16-Bit Inductive Encoder for Motor-Adjacent Position Sensing

    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Integrated Flexible Electronics Made of Magnetic Sensors Enables Electronic Skin Development

16.2.2022
Reading Time: 3 mins read
A A

First fully integrated flexible electronics made of magnetic sensors and organic circuits opens the path towards the development of electronic skin.

Human skin is a fascinating and multifunctional organ with unique properties originating from its flexible and compliant nature. It allows for interfacing with external physical environment through numerous receptors interconnected with the nervous system. Scientists have been trying to transfer these features to artificial skin for a long time, aiming at robotic applications.

RelatedPosts

Electroninks Enhanced Ultra-Fine Silver Ink Ready for Aerosol Jet Printing

Researches Developed Fast and Low Cost Prototyping Technique to Make Wearable Stretchable Sensors and Supercapacitors

High Energy Flexible Supercapacitors for IoT Applications

Operation of robotic systems heavily rely on electronic and magnetic field sensing functionalities required for positioning and orientation in space. A lot of research and development have been devoted into implementation of these functionalities in a flexible and compliant form. The recent advancements in flexible sensors and organic electronics provided important prerequisites. These devices can operate on soft and elastic surfaces, whereas sensors perceive various physical properties and transmit them via readout circuits.

To closely replicate natural skin, it is however necessary to interconnect a big number of individual sensors. This challenging task became a major obstacle in realizing electronic skin. First demonstrations were based on an array of individual sensors addressed separately, which unavoidably resulted into a tremendous number of electronic connections. In order to reduce the necessary wiring, an important technology step had to be done. Namely, complex electronic circuits, such as shift registers, amplifiers, current sources and switches must be combined with individual magnetic sensors to achieve fully integrated devices.

Researchers from Dresden, Chemnitz and Osaka could overcome this obstacle in a pioneering active matrix magnetic sensor system presented in a recent article of the journal Science Advances. The sensor system consists of a 2 x 4 array of magnetic sensors, an organic bootstrap shift register, required for controlling the sensor matrix, and organic signal amplifiers.

The special feature is that all electronic components are based on organic thin-film transistors and are integrated within a single platform. The researchers demonstrate that the system has a high magnetic sensitivity and can acquire the two-dimensional magnetic field distribution in real time. It is also very robust against mechanical deformation, such as bending, creasing or kinking. In addition to full system integration, the use of organic bootstrap shift registers is a very important development step towards active matrix electronic skin for robotic and wearable applications.

Prof. Dr. Oliver G. Schmidt, Director at the Leibniz Institute for Solid State and Materials Research Dresden and Dr. Daniil Karnaushenko on the next steps: “Our first integrated magnetic functionalities prove that thin-film flexible magnetic sensors can be integrated within complex organic circuits. Ultra-compliant and flexible nature of these devices is indispensable feature for modern and future applications such as soft-robotics, implants and prosthetics. The next step is to increase the number of sensors per surface area as well as to expand the electronic skin to fit larger surfaces.”

Original publication: M. Kondo, M. Melzer, D. Karnaushenko, T. Uemura, S. Yoshimoto, M. Akiyama, Y. Noda, T. Araki, O. G. Schmidt, T. Sekitani, Imperceptible magnetic sensor matrix system integrated with organic driver and amplifier circuits, Sci. Adv. 2020; 6: eaay6094, http://advances.sciencemag.org/.  DOI: 10.1126/sciadv.aay6094

Related

Source: IFW Dresden

Recent Posts

Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
15

Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

7.9.2026
11

Murata Expands Automotive Metal Power Inductor Range

7.9.2026
30

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
35

Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

3.9.2026
30

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
53

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
23

Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

27.8.2026
27

Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

26.8.2026
36

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved