Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

    ROHM Extends 2012 Shunt Resistors Power Rating up to 1.25 W

    January 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Passive Components in Quantum Computing

    0603 Automotive Chip Varistors as TVS Diode Replacements, TDK Tech Note

    Miniaturization of MLCCs and Electrolytics, KAVX Tech Chat

    Exxelia Offers Custom Naval Transformers and Inductors

    Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor

    Conductive Polymer Capacitor Market and Design‑In Guide to 2035

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

    ROHM Extends 2012 Shunt Resistors Power Rating up to 1.25 W

    January 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Passive Components in Quantum Computing

    0603 Automotive Chip Varistors as TVS Diode Replacements, TDK Tech Note

    Miniaturization of MLCCs and Electrolytics, KAVX Tech Chat

    Exxelia Offers Custom Naval Transformers and Inductors

    Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor

    Conductive Polymer Capacitor Market and Design‑In Guide to 2035

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

KEMET Extends KC-LINK™ MLCC C0G Range Using KONNEKT™ High-Density Packaging Technology

3.6.2020
Reading Time: 2 mins read
A A

KEMET Corporation a leading global supplier of electronic components, continues to strengthen its power conversion solutions by extending its popular MLCC C0G capacitors KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications.

This technology combines KC-LINK’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor.

RelatedPosts

NIC Components Extends SMD High Voltage MLCC Offering

Stackpole Offers RoHS Compliant Lead-Free Thick Film Chip Resistors

Smiths Interconnect’s SMD Power Resistors with Heat Sink Qualified to Space Flights

High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handling capability further. 

Combining KEMET’s revolutionary Class 1 C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. These components are positioned for growth within the DC/DC converter market in aerospace, medical and automotive applications. According to Business Insider*, the global DC-DC converter market is expected to grow at a CAGR of 17.5% from 2019 to 2025 and reach USD 22.4 billion by 2025. 

“The low ESR of KC-LINK capacitors results in best-in-class ripple current capability,” said Dr. John Bultitude, KEMET Vice President and Technical Fellow. “Combined with KONNEKT technology, this solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.” 

KEMET’s KC-LINK range with KONNEKT technology is available immediately via KEMET distributors. To learn more about KC-LINK with KONNEKT technology capabilities and applications, visit kemet.com/konnekt

*Source: DC-DC Converter Market by Vertical, Form Factor, Product Type, Output Power, Input Voltage, Output Voltage, Sales Channel, Output Number and Region – Forecast to 2025, Business Insider, November 2019

Related

Recent Posts

Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

23.1.2026
3

ROHM Extends 2012 Shunt Resistors Power Rating up to 1.25 W

23.1.2026
4

Passive Components in Quantum Computing

22.1.2026
42

0603 Automotive Chip Varistors as TVS Diode Replacements, TDK Tech Note

21.1.2026
17

Miniaturization of MLCCs and Electrolytics, KAVX Tech Chat

21.1.2026
42

Exxelia Offers Custom Naval Transformers and Inductors

21.1.2026
14

Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor

20.1.2026
29

Conductive Polymer Capacitor Market and Design‑In Guide to 2035

20.1.2026
97

TDK Releases High Performance 105C DC Link Film Capacitors

19.1.2026
53

Upcoming Events

Jan 27
16:00 - 17:00 CET

Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • How Metal Prices Are Driving Passive Component Price Hikes

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Degradation of Capacitors and its Failure Mechanisms

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version