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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

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    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Wk 45 Electronics Supply Chain Digest

    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

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Kyocera Doubling its Investment into Electronic Components over the Three Years

29.12.2022
Reading Time: 2 mins read
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Kyocera is more than doubling its capex and R&D budget to $9.78 billion over the three years March 2022-26, Kyocera’s President Hideo Tanimoto told the Nikkei Asia.

Kyocera will expand its investment in semiconductor-related production and other businesses, increasing total capital spending and research and development to 1.3 trillion yen ($9.78 billion) over the three fiscal years through March 2026, roughly doubling its previous three-year plan.

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KYOCERA Releases SAW Devices with Significantly Lower Loss

KYOCERA Releases Industry Smallest SAW Quadplexer

KYOCERA Developed Industry Leading 008004 Hi-Q MLCC for PA Modules

The Japanese electronics group will raise part of the funds by pledging its KDDI shares as collateral for the first time while borrowing up to 1 trillion yen. Kyocera President Hideo Tanimoto recently revealed the plans to Nikkei.

Having maintained a debt-free management policy, Kyocera will make aggressive investments in areas including ceramic components as it expects the chip market to expand over the medium term. The company plans up to 900 billion yen in capital expenditures, about double the amount over the past three years, and aims to spend 400 billion yen on R&D, a 60% increase.

In Kagoshima prefecture in southern Japan, Kyocera is investing about 60 billion yen to construct a new semiconductor package production facility. In Nagasaki, the company is constructing its first new domestic plant in about 20 years, since the start of operations at its Ayabe factory in Kyoto. Tanimoto said the company plans to “invest up to 100 billion yen to produce ceramic components and semiconductor packaging,” with the new plant set to begin operating in 2026.

The area is located near other chip plants such as that of Sony Group and is near an expressway interchange and other transportation infrastructure. In Vietnam, meanwhile, Kyocera is expanding factories producing multifunctional machines and quartz components.

Related

Source: Nikkei Asia

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