Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Liquid electrolyte contacts for advanced characterization of resistive switching memories

28.7.2017
Reading Time: 2 mins read
A A

source: EurekAlert news

The group lead by Prof. Paul C. McIntyre at Stanford University has recently developed a new methodology to observe in situ local conductivity changes on resistive electrodes of memristors.

RelatedPosts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

Memristors are nanosized electronic devices that can be used to fabricate next generation memories, and to build up electronic synapses for neuromorphic computing. A memristor consists on a metal-insulator-metal nanocell, in which electrical impulses are applied between the electrodes to modulate the resistivity of the insulator. In this way, a high and a low resistivity state can be intentionally and cyclically induced, which can be used to simulate the ones and zeros of the binary code. The resistivity changes are generated due to local atomic rearrangements produced by the electrical field applied, but understanding this phenomenon is very challenging because i) it takes place in very small areas, and ii) it happens at the insulating stack, which is buried in the top electrode.

The group lead by Prof. Paul C. McIntyre at Stanford University has recently developed a new methodology to observe in situ these local conductivity changes. The method consists on replacing the top electrode by a conductive liquid electrolyte, which can be polarized to stress the insulator. After the stress, the electrolyte can be rinsed and the surface of the insulator is scanned via conductive atomic force microscopy. The nanoscale studies have been carried by Prof. Mario Lanza’s group, and reveal the formation of local spots with diameters below 4 nm that are responsible for the conductivity change. By tuning the conductivity of the liquid electrolyte, this method even allows distinguishing the contribution of electrical field and thermal heat into the currents generated.

featured image:
(left) schematic of the ionic liquid experiment. (center and right) topographic and current maps obtained with the CAFM after the ionic liquid stress. The CAFM is able to detec a single conductive spot within a circular area with a diameter of 20 micrometers. Source: Experimental Lanzalab

Related

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
11

Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

3.9.2026
9

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

1.9.2026
8

Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

31.8.2026
19

Modelithics COMPLETE v26.4 Expands RF Passive Models for Keysight ADS

28.8.2026
13

Bourns Extends Current Sense Resistors for High-Current Power Designs with 0.1 mΩ, 15 W

26.8.2026
43

Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

24.8.2026
31

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
125

Single Pair Ethernet for Humanoid Robot In-Robot Networks

17.8.2026
179

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved