Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Machine learning used to quickly analyze key capacitor materials

5.3.2019
Reading Time: 4 mins read
A A

Source: Science Daily news

by: Georgia Institute of Technology. Researchers are using machine learning to ultimately find ways to build more capable capacitors.

RelatedPosts

TDK X Series SMD Varistors for Industrial Transient Protection

Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

Capacitors, given their high energy output and recharging speed, could play a major role in powering the machines of the future, from electric cars to cell phones. But the biggest hurdle for these energy storage devices is that they store much less energy than a battery of similar size.

Researchers at Georgia Institute of Technology are tackling that problem in a novel way, using machine learning to ultimately find ways to build more capable capacitors. The method, which was described in February 18 in the journal npj Computational Materials and sponsored by the U.S. Office of Naval Research, involves teaching a computer to analyze at an atomic level two materials that make up some capacitors: aluminum and polyethylene.

The researchers focused on finding a way to more quickly analyze the electronic structure of those materials, looking for features that could affect performance.

“The electronics industry wants to know the electronic properties and structure of all of the materials they use to produce devices, including capacitors,” said Rampi Ramprasad, a professor in the School of Materials Science and Engineering.

Take a material like polyethylene: it is a very good insulator with a large band gap — an energy range forbidden to electrical charge carriers. But if it has a defect, unwanted charge carriers are allowed into the band gap, reducing efficiency, he said.

“In order to understand where the defects are and what role they play, we need to compute the entire atomic structure, something that so far has been extremely difficult,” said Ramprasad, who holds the Michael E. Tennenbaum Family Chair and is the Georgia Research Alliance Eminent Scholar in Energy Sustainability. “The current method of analyzing those materials using quantum mechanics is so slow that it limits how much analysis can be performed at any given time.”

Ramprasad and his colleagues, who specialize in using machine learning to help develop new materials, used a sample of data created from a quantum mechanics analysis of aluminum and polyethylene as an input to teach a powerful computer how to simulate that analysis.

Analyzing the electronic structure of a material with quantum mechanics involves solving the Kohn-Sham equation of density functional theory, which generates data on wave functions and energy levels. That data is then used to compute the total potential energy of the system and atomic forces.

Using the new machine learning method produces similar results eight orders of magnitude faster than using the conventional technique based on quantum mechanics.

“This unprecedented speedup in computational capability will allow us to design electronic materials that are superior to what is currently out there,” Ramprasad said. “Basically we can say, ‘Here are defects with this material that will really diminish the efficiency of its electronic structure.’ And once we can address such aspects efficiently, we can better design electronic devices.”

 

left image: Rampi Ramprasad, a professor in the School of Materials Science and Engineering, holds an aluminum-based capacitor. Credit: Allison Barnes, Georgia Tech

 

 

While the study focused on aluminum and polyethylene, machine learning could be used to analyze the electronic structure of a wide range materials. Beyond analyzing electronic structure, other aspects of material structure now analyzed by quantum mechanics could also be hastened by the machine learning approach, Ramprasad said.

“In part we selected aluminum and polyethylene because they are components of a capacitor, but it also allowed us to demonstrate that you can use this method for vastly different materials, such as metals that are conductors and polymers that are insulators,” Ramprasad said.

 

The faster processing allowed by the machine learning method would also enable researchers to more quickly simulate how modifications to a material will impact its electronic structure, potentially revealing new ways to improve its efficiency.

featured image:

Overview of the process used to generate surrogate models for the charge density and density of states. The first step entails the generation of the the training dataset by sampling random snapshots of molecular dynamics trajectories. First-principles calculations were then performed on these systems (shown in Figure S1) to obtain the training atomic configurations, charge densities, and local density of states. The scalar (S), vector (V), and tensor (T) fingerprint invariants are mapped to the local electronic structure at every grid-point. For the charge density, this mapping is achieved using a simple fully connected neural network with one output neuron. The LDOS spectrum, on the other hand, is learned via a recurrent neural network architecture, wherein the LDOS at every energy window is represented as a single output neuron (linked via a recurrent layer to other neighboring energy windows). The trained model is then used to predict the electronic structure (i.e, DOS and charge density) of an unseen configuration.

featured image source: Georgia Institute of Technology

Story Source:

Science Daily article. Materials provided by Georgia Institute of Technology. Note: Content may be edited for style and length.

Journal Reference:

Anand Chandrasekaran, Deepak Kamal, Rohit Batra, Chiho Kim, Lihua Chen, Rampi Ramprasad. Solving the electronic structure problem with machine learning. npj Computational Materials, 2019; 5 (1) DOI: 10.1038/s41524-019-0162-7

Related

Recent Posts

Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
59
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
20
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
35
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
52
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
31
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
30
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
39
TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

TDK Expanded DC-Link Film Capacitors to Reach +135 °C

2.10.2026
52
Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

Electrification Raises Demands on DC-Link Capacitors

1.10.2026
38

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved