Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samtec Expands Connector Severe Environment Testing Offering

    Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

    YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

    Enhancing Energy Density in Nanocomposite Dielectric Capacitors

    Advances in the Environmental Performance of Polymer Capacitors

    Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

    Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Samtec Expands Connector Severe Environment Testing Offering

    Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

    YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

    Enhancing Energy Density in Nanocomposite Dielectric Capacitors

    Advances in the Environmental Performance of Polymer Capacitors

    Vishay Releases DLA Tantalum Polymer Capacitors for Military and Aerospace

    Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

    Paumanok Releases Capacitor Foils Market Report 2025-2030

    Modelithics Welcomes CapV as a Sponsoring MVP

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Microscopic Magnetic Structures Revealed

17.12.2015
Reading Time: 2 mins read
A A

source: ECN article

Wed, 12/16/2015 – 2:32pm by Tohoku University

RelatedPosts

Samtec Expands Connector Severe Environment Testing Offering

Silicon Capacitors Market: Shaping the Foundation for Next-Gen Miniaturization Electronics

YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

The research group of Professor Hideo Ohno and Associate Professor Shunsuke Fukami of Tohoku University has studied in detail, a slow change of microscopic magnetic structures in metallic wires induced by external driving forces, commonly called “creep” motion. This has allowed them to clarify the physics of how the driving forces, magnetic fields or electric currents, act on the magnetic structure.

Previous studies had shown that while the actions of magnetic fields and currents are the same for metallic materials, they are fundamentally different for semiconductor materials.

The present study reveals that in cases where the sample satisfies a certain condition, the current acts on the magnetic structure in a different manner from the magnetic field case, irrespective of the intricacies of the material.

The development of a high-performance magnetic memory device (where the magnetic structure is manipulated by current) has been intensively pursued recently, and the present findings are expected to facilitate the fundamental understanding to achieve the practical application.

The research group fabricated a wire device consisting of a ferromagnetic metal CoFeB, and investigated the universality class of a magnetic domain wall “creep”. They evaluated the domain wall velocity for various magnitudes of magnetic field or electric current while keeping the device temperature constant, from which they derived the scaling exponent for the universality class.

The results indicate that the scaling exponent does not depend on factors such as temperature and wire width, for both magnetic field and current cases, confirming the universality of the observed feature. Interestingly, unlike the previous study on metallic systems, they found different universality classes between magnetic field and current-driven domain wall creeps in the present metallic sample.

This means that the actions of a magnetic field and current on the domain wall are fundamentally different from each other. The field-driven “creep” was found to belong to a previously known universality class, whereas the current-driven “creep” was found to belong to a different universality class which cannot be explained by the present theories and the scaling exponent was similar to the one observed previously in the magnetic semiconductor.

From detailed investigations of the behavior of the domain wall under the application of a current, they found that the current gives rise to an adiabatic spin-transfer torque acting on the domain wall which has a different symmetry to the torque induced by a magnetic field. In other words, it was clarified that, for sample in which stack structure is designed so that the adiabatic spin-transfer torque dominantly affects the domain wall, universal creep characteristics appear irrespective of the nature of material, such as metal or semiconductor, the details of microscopic structure.

The obtained findings shed light on a statistical physics of creep motion of elastic interfaces and development of high-performance magnetic memory devices.

Featured Picture: Schematic of domain wall creep. When a very weak magnetic field or electric current is applied to the magnetic wire with domain wall, the domain wall behaves as an elastic interface and slowly moves, creeps.

Related

Recent Posts

YAGEO Releases Compact Coupled Inductors for High-Density VR Designs

9.10.2025
14

Vishay Expanded Inductor Portfolio With More Than 2000 Stock Items 

8.10.2025
12

Researchers Demonstrated High Energy Ceramic Capacitors Stable in Wide Temperature Range

2.10.2025
25

Experimental Evaluation of Wear Failures in SMD Inductors

1.10.2025
41

Improving SMPS Performance with Thermal Interface Material

30.9.2025
12

Flaked Tantalum Powders: High Capacitance Powders for High Reliable Tantalum Capacitors

29.9.2025
22

Efficient Power Converters: Duty Cycle vs Conduction Losses

29.9.2025
34

Life Cycle Assessment of a Graphene-Based Supercapacitor

26.9.2025
18

Advancements in Flexible End Terminations for Robust MLCCs in EV

26.9.2025
43

Passive Components J-STD-075 Process Sensitivity Level Classification And Labeling

25.9.2025
61

Upcoming Events

Oct 14
16:00 - 17:00 CEST

Smart Sensors, Smarter AI: Building Reliable Edge Systems

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

Oct 21
October 21 @ 12:00 - October 23 @ 14:15 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

Oct 28
8:00 - 15:00 CET

Power Up Your Design: SN6507 and the Ready-to-Use Development Kit

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version