Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TDK Releases Ultra-small PFC Capacitors

    KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

    Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    TDK Releases Ultra-small PFC Capacitors

    KYOCERA AVX Releases Novel Mini BME Stacked Ceramic Capacitors

    Vishay Releases Class 1 Leaded High Voltage Ceramic Disc Capacitors

    TDK Releases 140C Compact Vibration Robust Automotive Aluminum Capacitors

    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Miniaturization of PCBs with Embedded Active and Passive Components; WE Webinar

11.8.2025
Reading Time: 5 mins read
A A

This Würth Elektronik webinar dives into the fascinating world of miniaturization of printed circuit boards with embedded active and passive components.

The efficient use of ever smaller housing volumes and tiny surfaces is becoming increasingly important. Embedding technology is the proven solution to these challenges.

RelatedPosts

Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

SEPIC Converter with Coupled and Uncoupled Inductors

Würth Elektronik Releases Push-Button and Main Switches

Find out more about the advantages and possibilities of embedding technologies using the case study of our physical PCB sample WEembed. Plagiarism protection and improved protection against environmental influences are included free of charge.

In our webinar we will offer you insights into:

  • our WE.embed physical PCB sample and what you can learn from it
  • the advantages of DEVICE.embedding technology
  • the current standards of embedding technology and their application

Technical Article: Advanced Insights into PCB Device Embedding and Miniaturization

Introduction

Welcome to an in-depth exploration of device embedding, miniaturization, and reliability in printed circuit board (PCB) technology. This article captures critical insights from a recent webinar hosted by Andrea Schil featuring Yan Wolf, Head of the Advanced Solutions Center at WE Electronic Circuit Board Technology.

Overview of PCB Device Embedding

Device embedding in PCBs is a transformative technology that enhances miniaturization, functional reliability, and thermal management. The process strategically integrates components within PCB layers, optimizing space and improving performance.

Key Benefits of Device Embedding

  1. Miniaturization: Embedding components reduces board real estate requirements, enabling compact device designs without compromising functionality.
    • Custom Packaging: Create bespoke packages for specific circuitry needs.
    • Space Efficiency: Utilize internal PCB layers to add components beyond the surface.
  2. Performance & Functionality:
    • Integrated Shielding: Embedded components benefit from natural EMI shielding using surrounding copper layers.
    • Short Signal Paths: Reduced signal travel distances improve speed and reduce power loss.
    • Anti-Plagiarism Measures: Concealing components within layers protects against reverse engineering.
  3. Reliability:
    • Environmental Protection: Embedded components are less susceptible to moisture, mechanical stress, and temperature extremes.
    • Enhanced Thermal Management: Better heat dissipation through direct copper contact.

Technical Process of Device Embedding

  1. Inner Layer Preparation:
    • Structuring copper layouts.
    • Applying solder resist to create solder windows for component placement.
    • Surface finishing with modified chemical tin to aid soldering and adhesion.
  2. Component Assembly:
    • Standard SMD processes for component placement.
    • Rigorous cleaning protocols to ensure void-free lamination.
  3. Multilayer Stack-Up and Lamination:
    • Use of prepregs with precision cutouts forming virtual cavities.
    • High-pressure, vacuum-assisted lamination to encapsulate components seamlessly.
  4. Finishing Processes:
    • Drilling, plating, and final outer layer structuring.
    • Comprehensive testing tailored to project specifications (ICT, functional tests).

Case Study: PCB Sample “We Embed”

The sample features:

  • Six Copper Layers with components embedded on layer 4.
  • Component Variety: LEDs, resistors, capacitors, and active ICs in diverse packages (UDFN, TSSOP, QFN).
  • Functional Demonstration: A running light circuit accessible via USB power.

Design Considerations and Testing

  • Layer Count Flexibility: From minimal configurations to complex multi-layered designs.
  • Component Thickness: Custom stack-ups accommodating various component heights.
  • Testing Protocols: Defined collaboratively with clients to meet application-specific reliability standards.

Cost Implications

Costs are influenced by:

  • Base PCB technology (rigid, flex, HDI).
  • BOM specifics and component sourcing.
  • Assembly complexity and testing requirements.

Conclusion

Device embedding significantly advances PCB design by enabling compact, high-performance, and reliable electronic solutions. For more information, technical guidelines, and sample requests, visit WE Electronic’s website or reach out to their technical support team.

Related

Source: Würth Elektronik

Recent Posts

Glass Core Technology Breakthrough Potential for High-Speed Interconnects

12.6.2025
50

What Track Width To Use When Routing PCB

6.6.2025
61

Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

15.5.2025
49

High-Density PCB Assemblies For Space Applications

2.5.2025
52

IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025
501

HIROSE Expands Open Pluggable OPS PCB connector

9.1.2025
52

How to Determine Chip Temperature

3.1.2025
220

Die and Wire PCB Bonding Explained

1.7.2025
157

EMI Shielding Challenges

1.7.2025
15

EMC with Electromechanical Inter-Connections

1.7.2025
15

Upcoming Events

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

Oct 20
October 20 - October 23

Digital WE Days 2025 – Virtual Conference

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version