Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases Compact High Current Shielded Power Inductors

    March 2026 Interconnect, Passives and Electromechanical Components Market Insights

    Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions

    APEC 2026 Power Electronics Trends and Implications for Passive Components

    Hydra Enhances Film Capacitor Robustness by Novel Gel Filler

    Würth Elektronik Releases Heat Sinks for TO and IC packages

    Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

    Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

    Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata Releases Worlds First Molded Thermistor with Wire-Bonding

12.6.2025
Reading Time: 2 mins read
A A

Murata Manufacturing announced the launch of the FTI Series (FTN21XH502F0SRU), a groundbreaking NTC thermistor that sets a new industry standard for automotive thermal management.

The product is the world’s first to achieve both a resin-molded design and wire-bonding compatibility in a single thermistor.

RelatedPosts

Murata to Decouple China Rare Earth Supply in 3 Years

Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

The integration of these two innovations provides unprecedented flexibility for designing and assembling printed circuit boards (PCBs), directly addressing the needs of modern automotive applications, including electric vehicle (EV) inverters and DC-DC converters.

Featuring a resin-molded structure, together with wire-bonding compatibility, allows for highly flexible installation directly on the PCB and in closer proximity to power semiconductor components. This advancement eliminates the need for dedicated sensor mounting pads, which have traditionally restricted layout options and increased board size. As a result, design engineers gain much greater freedom in PCB design, enabling more compact and efficient modules – especially important in modern EVs, where electronic controls must be highly integrated in tight spaces.

Another key strength of the FTI Series is its high-temperature operating capability. Leveraging Murata’s proprietary external electrode bonding technology, the thermistor ensures reliable performance in harsh environments, with guaranteed operation up to 175°C. This is among the highest in industry and is critical for next-generation automotive applications, especially within powertrains and other high-power modules where heat management is a constant challenge. With this level of heat resistance, automotive designers can ensure the safety, stability, and longevity of their systems even under demanding conditions, such as those found in EV inverters and DC-DC converters.

By enabling precise and rapid temperature measurement directly adjacent to semiconductor devices, the FTI Series allows for a reduction in temperature margins within a system’s design. This means that a power semiconductor’s performance can be maximized without over-engineering for excessive safety margins, creating opportunities to reduce the size of chips or the number of chips used in parallel, leading to smaller modules and lower overall costs. Further, this cost-saving feature does not come at the expense of reliability or performance, making the thermistor an ideal solution for manufacturers seeking to optimize their designs both technically and economically. The FTI Series is available in a compact 2012 mm / 0805-inch package and exhibits a resistance at 25 °C (R25) of 5 kΩ ± 1% with a B-constant (25 °C / 50 °C) of 3380 K ± 1%.

“In response to the increasingly sophisticated requirements of the automotive market, Murata remains committed to expanding its product lineup to include a broader range of resistance values and to offer new variations, such as silver sintering-compatible models in addition to traditional solder-mounted types,” said Munenori Hikita, Director of Functional Devices Division at Murata. He continued, “Through these ongoing efforts, and development of solutions like the new FTI series, Murata continues to support the advancement of EV technology and the broader automotive industry by delivering innovative, reliable, and cost-effective solutions.”

Related

Source: Murata

Recent Posts

Würth Elektronik Releases Heat Sinks for TO and IC packages

31.3.2026
15

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

31.3.2026
20

Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

30.3.2026
68

Exxelia Miniaturized 400 MHz Inverted‑F Antenna

24.3.2026
15

Würth Elektronik Unveils High-Current Automotive Power Inductor

24.3.2026
31

Inductor Technology Dossier

19.3.2026
66

Coilcraft Releases TLVR Inductors for High Density VRMs and PoL Converters

19.3.2026
55

Würth Elektronik Presents Differential Pressure Sensor for HVAC and Medical

17.3.2026
21

Würth Elektronik and Grinn Launch Edge AI Cooperation

13.3.2026
27

Upcoming Events

Apr 8
17:00 - 18:00 CEST

Trade Secrets of the Flyback Converter

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version