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    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

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    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

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NASA Keynote “Technology Assurance for Space Systems in an Age of Rapid Diversification” will Open CMSE 2020 Conference

19.2.2020
Reading Time: 2 mins read
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CMSE 2020 Advance Program now available on line! Over 30 technical presentations by industry leaders focused on advanced packaging of ICs, passive components and a variety of other topics critical to components used in high rel mil and aerospace systems. EPCI is proud CMSE sponsor and active participant.Technology Assurance for Space Systems in an Age of Rapid Diversification is a CMSE Keynote Topic that will be presented by Dr. Jonathan Pellish, NASA’s Electrical, Electronic, Electromechanical, and Electro-Optical (EEEE) Parts Manager to welcome CMSE attendees this year.

Scheduled to get CMSE 2020 started is Dr. Pellish at his keynote speech about the ability to design, build, and successfully operate blended systems with varying degrees of commercial-off-the-shelf (COTS) and military-aerospace grade components:

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Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

Being a member of today’s aerospace community can be exciting, confusing, and scary –sometimes simultaneously. As assurance engineers, commodity specialists, and designers, we face an array of challenges concerning the proper selection and acceptance of electrical, electronic, electromechanical, and electro-optical components.

The ability to design, build, and successfully operate blended systems with varying degrees of commercial-off-the-shelf (COTS) and military-aerospace grade components is no longer innovation, it is a requirement. The cost, performance, and schedule expectations of today’s missions often demand the use of COTS components or technologies, including automotive electronics and advanced packaging solutions. This has placed unique burdens on an already-stretched workforce, existing technical guidelines and standards,as well as key test facilities.

These market stresses have also stimulated demand within the community of component suppliers, who now offer a growing range of different mid-space or alternative grade options between pure COTS and traditional military-aerospace grade components. We will discuss strategies for coping with this changing landscape as well as some of the efforts afoot to build lasting solutions. In either case, continued evolution is essential.

The 24th Annual Components for Military and Space Electronics (CMSE) is set for April 21-23, 2020, at Four Points by Sheraton in Los Angeles. The industry’s premier event will provide access to more than 30 technical presentations by industry leaders, focused on advanced packaging of ICs, passive components, and a number of other topics critical to components used in high reliability military and aerospace systems.

There will be cutting-edge tutorials, along with two days of exhibition and technical presentations, that will educate, inform, and provide solutions for current challenges within the military and space electronics business.

CMSE 2020 advance program is available at the link below, to learn more about CMSE and to register, visit www.tjgreenllc.com/cmse.

Related

Source: CMSE Advance Program

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