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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

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    Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

    Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

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    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

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    Choosing the Right Capacitor: The Importance of Accurate Measurements

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NASA Keynote “Technology Assurance for Space Systems in an Age of Rapid Diversification” will Open CMSE 2020 Conference

19.2.2020
Reading Time: 2 mins read
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CMSE 2020 Advance Program now available on line! Over 30 technical presentations by industry leaders focused on advanced packaging of ICs, passive components and a variety of other topics critical to components used in high rel mil and aerospace systems. EPCI is proud CMSE sponsor and active participant.Technology Assurance for Space Systems in an Age of Rapid Diversification is a CMSE Keynote Topic that will be presented by Dr. Jonathan Pellish, NASA’s Electrical, Electronic, Electromechanical, and Electro-Optical (EEEE) Parts Manager to welcome CMSE attendees this year.

Scheduled to get CMSE 2020 started is Dr. Pellish at his keynote speech about the ability to design, build, and successfully operate blended systems with varying degrees of commercial-off-the-shelf (COTS) and military-aerospace grade components:

RelatedPosts

Modelithics Library for MATLAB: Measurement-Based Models for Microwave and RF Passive Components

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

Being a member of today’s aerospace community can be exciting, confusing, and scary –sometimes simultaneously. As assurance engineers, commodity specialists, and designers, we face an array of challenges concerning the proper selection and acceptance of electrical, electronic, electromechanical, and electro-optical components.

The ability to design, build, and successfully operate blended systems with varying degrees of commercial-off-the-shelf (COTS) and military-aerospace grade components is no longer innovation, it is a requirement. The cost, performance, and schedule expectations of today’s missions often demand the use of COTS components or technologies, including automotive electronics and advanced packaging solutions. This has placed unique burdens on an already-stretched workforce, existing technical guidelines and standards,as well as key test facilities.

These market stresses have also stimulated demand within the community of component suppliers, who now offer a growing range of different mid-space or alternative grade options between pure COTS and traditional military-aerospace grade components. We will discuss strategies for coping with this changing landscape as well as some of the efforts afoot to build lasting solutions. In either case, continued evolution is essential.

The 24th Annual Components for Military and Space Electronics (CMSE) is set for April 21-23, 2020, at Four Points by Sheraton in Los Angeles. The industry’s premier event will provide access to more than 30 technical presentations by industry leaders, focused on advanced packaging of ICs, passive components, and a number of other topics critical to components used in high reliability military and aerospace systems.

There will be cutting-edge tutorials, along with two days of exhibition and technical presentations, that will educate, inform, and provide solutions for current challenges within the military and space electronics business.

CMSE 2020 advance program is available at the link below, to learn more about CMSE and to register, visit www.tjgreenllc.com/cmse.

Related

Source: CMSE Advance Program

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