Correlation between Calculation & Practice for Simple TOP-to-BOTTOM PCB Heat Dissipation
This Würth Elektronik webinar aim to show where the difference between calculation and measurement of PCB heat dissipation comes from, ...
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Filter Calculation and Selection with REDEXPERT EMI Filter Designer; WE Webinar
This Würth Elektronik video introduces REDEXPERT EMI Filter Designer as a tool to simplify filter calculation and filter selection. REDEXPERT ...
Bourns Downsize its SMD Fuse Line with 0402 Package
Bourns is pleased to announce the introduction of a new 0402 package size SMD fuse series to complement its already ...
Feedback from Connector Failure Analysis
In this paper SERMA TECHNOLOGIES presents failure statistics of connectors from field return analyzed during the last 10 years. The ...
Voltage Dependence of Ferroelectric Class 2 Multilayer Ceramic Capacitors
This paper describes the physical background of the voltage-dependent capacitance of class II Multilayer Ceramic Capacitors (MLCC) and present models ...
Thick Film on Steel Resistor Technology – Increasingly Power Dense & Demanding Applications
The paper was presented by Chris Muter, TT Electronics, UK at the 4th PCNS 10-14th September 2023, Sønderborg, Denmark as paper No.2.4. Thick ...
LTSpice for the Validation of Power Converters
This webinar by Würth Elektronik focuses on use of LTSpice to automate validation of electronic design in an example of ...
Creepage and Clearance of Connector
This video from Würth Elektronik elaborates on clearance and creepage distance and solid insulation materials. Many applications of fire are ...
Selecting MLCC’s That Meet High Reliability Requirements of Medical Implantable Devices
Designing medical implantable devices for high reliability is crucial for a variety of reasons. To ensure that used components are ...
De-Risking Plan at Cryogenic Temperatures for PETERCEM Microswitch
The challenge of Space operating components increases from one year to another. This paper study capability and physical mechanisms of ...
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