Quantic Eulex unveils the XG series groundbreaking high frequency RF ceramic capacitor technology offering superior performance for next-gen RF and microwave designs.
A Quantum Leap in Capacitor Performance
The XG Series represents a transformative advancement in high-frequency circuit technology.
The XG Series capacitors introduces an array of breakthrough features designed to elevate high-frequency circuit performance, providing a tenfold increase in capacitance compared to traditional solutions while maintaining Class 1 dielectric stability and High Q factors.
They exhibit inherently ultra-low ESR and ESL, allowing for broader bandwidths and reduced signal loss—critical for RF and microwave systems that demand precision and reliability.
Additional key attributes include high voltage and high ripple current handling capabilities, making them suitable for the most demanding high power and high-frequency applications. Available as individual capacitors or in an array, their ultra-compact, low-profile design is suitable for surface-mount or embedded configurations. Whether integrated into small form-factor modules or large-scale antenna systems, the XG Series delivers unparalleled versatility and performance across diverse platforms.
The Eulex gap capacitors deliver:
- High Q, High SRF, and Low Loss features
- Tenfold Increase in Capacitance compared to conventional capacitors.
- Ultra-low ESR and ESL, enabling broader bandwidths and minimized signal loss.
- Exceptional Voltage and Current Handling, ideal for high-power, high-frequency applications.
Engineered for versatility, the XG Series fits seamlessly into both small form-factor modules and large-scale antenna systems, offering unparalleled performance in RF and microwave systems.
Revolutionary Internal Design Sets New Industry Standards
What distinguishes the XG Series is its innovative internal architecture, featuring:
- Embedded Top Electrode: Enhances capacitance while reducing parasitics, thanks to shorter electrode distances.
- True Single-Layer Construction: Minimizes resistive losses, delivering superior high-frequency responses.
- Elimination of Parasitics: Removes traditional wire bonds, vias, and terminations, significantly improving reliability and reducing manufacturing costs.
Industry Leaders Praise the XG Series
Sebastian Palacio, Vice President and General Manager of Planar Monolithics Industries (PMI), lauds the XG Series’ transformative potential:
“Our independent evaluation of Eulex Gap Capacitors has revealed outstanding performance across critical parameters. The combination of lower cost, higher Q, improved RF metrics, increased power/voltage handling, and the elimination of wire bonds represents a significant advancement in capacitor technology. These capacitors are easy to integrate into the most demanding RF designs.”
One Eulex X3G Series Gap Capacitor can replace 10 or more MLCCs or 3-Terminal MLCCs, simplifying BOM and reducing failure points:
