Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers 3D print ultralight supercapacitors

24.5.2022
Reading Time: 3 mins read
A A

For the first time ever, scientists at Lawrence Livermore National Laboratory and UC Santa Cruz have successfully 3D-printed supercapacitors using an ultra-lightweight graphene aerogel, opening the door to novel, unconstrained designs of highly efficient energy storage systems for smartphones, wearables, implantable devices, electric cars and wireless sensors.

Using a 3D-printing process called direct-ink writing and a graphene-oxide composite ink designed at the Lab, the LLNL team was able to print micro-architected electrodes and build supercapacitors able to retain energy on par with those made with electrodes 10 to 100 times thinner.

RelatedPosts

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

Lightweight Model for MLCC Appearance Defect Detection

The results were released online in the journal Nano Letters on Jan. 28.

“This breaks through the limitations of what 2D manufacturing can do,” said engineer Cheng Zhu, the paper’s lead author. “We can fabricate a large range of 3D architectures. In a phone (for instance) you would only need to leave a small area for energy storage. The geometry can be very complex.”

The micro-architectured, ultra-lightweight supercapacitor material is able to retain energy on par with those made with electrodes 10 to 100 times thinner. Supercapacitors also can charge incredibly fast, Zhu said, in theory requiring just a few minutes or seconds to reach full capacity. In the future, Zhu and his fellow researchers believe newly designed 3D-printed supercapacitors will be used to create unique electronics that are currently difficult or even impossible to make using other synthetic methods, including fully customized smartphones and paper-based or foldable devices, while at the same time achieving unprecedented levels of performance.

“We’re pioneering the marriage of 3D-printing and porous materials,” said material and biomedical scientist Fang Qian, a co-author on the paper. “Think of a supercapacitor as a portable energy device, so anything that needs electricity would benefit from such a supercapacitor. If we can replace the standard (technology) with our lightweight, compact and high-performance supercapacitor, that would be a radical change.”

Graphene-based inks, the researchers said, have a distinct advantage over carbon-based materials due to their ultrahigh surface area, lightweight properties, elasticity and superior electrical conductivity. The graphene composite aerogel supercapacitors also are extremely stable, the researchers reported, capable of nearly fully retaining their energy capacity after 10,000 consecutive charging and discharging cycles.

“Additively manufactured 3D architectures for energy storage will improve energy and power characteristics for supercapacitors, enabling lightweight, miniaturized power sources,” said LLNL materials engineer Eric Duoss. “Graphene is a really incredible material because it is essentially a single atomic layer that can be created from graphite. Because of its structure and crystalline arrangement, it has really phenomenal capabilities.”

The Lab researchers worked closely with UC Santa Cruz professor Yat Li and grad student Tianyu Liu, who performed the electrochemical characterizations and optimized the materials used in the process.

Over the next year, the researchers intend to expand the technology by developing new 3D designs, using different inks and improving the performance of existing materials.

“This is definitely a first step toward the future,” Zhu said. “There will be more to come.”

Related

Source: Lawrence Livermore National Laboratory

Recent Posts

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

3.11.2025
7

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

3.11.2025
6

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
2

DMASS Reports First Positive Signs of European Distribution Market in Q3/25

3.11.2025
3

TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

3.11.2025
2

Capacitor Self-balancing in a Flying-Capacitor Buck Converter

30.10.2025
24

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
32

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
32

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

23.10.2025
62

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
48

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version