Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Wk 45 Electronics Supply Chain Digest

    Transformer Safety IEC 61558 Standard

    ESR of Capacitors, Measurements and Applications

    Murata Christophe Pottier Appointed President of EPCIA

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    YAGEO Unveils Compact 2.4 GHz SMD Antenna

    KYOCERA AVX Releases Antenna for Iridium Satellite IoT Applications

    Molex Releases Industry-First Quad-Row Board-to-Board Connectors with EMI Shields

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Developed Polymer Film that Protects from Electromagnetic Radiation and EMI Signal Interference

24.5.2022
Reading Time: 5 mins read
A A

Researchers from the University of California-Riverside have demonstrated a flexible polymer film which combines electromagnetic shielding with electrical isolation. The breakthrough combines excellent electromagnetic shielding with ease of manufacture and electrical isolation.

As electronic devices saturate all corners of public and personal life, engineers are scrambling to find lightweight, mechanically stable, flexible, and easily manufactured materials that can shield humans from excessive electromagnetic radiation as well as prevent electronic devices from interfering with each other. 

RelatedPosts

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

Wk 45 Electronics Supply Chain Digest

Transformer Safety IEC 61558 Standard

A flexible polymer film filled with bundles of needle-like threads of 1D TaSe3 shields electronics from electromagnetic interference. (Zahra Barani)

In a breakthrough report published in Advanced Materials—the top journal in the field— engineers at the University of California, Riverside describe a flexible film using a quasi-one-dimensional nanomaterial filler that combines excellent electromagnetic shielding with ease of manufacture.

“These novel films are promising for high-frequency communication technologies, which require electromagnetic interference shielding films that are flexible, lightweight, corrosion resistant, inexpensive, and electrically insulating,” said senior author Alexander A. Balandin, a distinguished professor of electrical and computer engineering at UC Riverside’s Marlan and Rosemary Bourns College of Engineering. “They couple strongly to high-frequency radiofrequency radiation while remaining electrically insulating in direct current measurements.”

Electromagnetic interference, or EMI, occurs when signals from different electronic devices cross each other, affecting performance. The signal from a cell phone or laptop WiFi, or even a kitchen blender, might cause static to appear on a TV screen, for example. Likewise, airlines instruct passengers to turn off cellphones during landing and takeoff because their signals can disrupt navigation signals. 

Engineers long ago learned that any electrical device could possibly influence the functioning of a nearby device and developed materials to shield electronics from interfering signals. But now that electronic devices have become ubiquitous, small, wirelessly connected, and critical to innumerable essential services, the opportunities for and risks of EMI-caused malfunctions have proliferated, and conventional EMI shielding materials are often insufficient. More electronic devices mean humans are also exposed to greater electromagnetic radiation than in the past. New shielding materials will be needed for the next generation of electronics.

Balandin led a team that developed the scalable synthesis of composites with unusual fillers— chemically exfoliated bundles of quasi-one-dimensional van der Waals materials. The composites demonstrated exceptional EMI shielding materials in the gigahertz and sub-terahertz frequency ranges, important for current and future communication technologies, while remaining electrically insulating.

Graphene is the most famous van der Waals material. It is two-dimensional because it is a plane of strongly bound atoms. Many planes of graphene, weakly coupled by van der Waals forces, make up a bulk graphite crystal. For many years, research was focused specifically on two-dimensional layered van der Waals materials, which exfoliate into planes of atoms.

One dimensional van der Waals materials consist of strongly bound atomic chains, rather than planes, which are weakly bound by van der Waals forces. Such materials exfoliate into needle-like “one-dimensional” structures rather than two-dimensional planes. The Balandin group conducted pioneering studies of one-dimensional metals demonstrating their unusual properties. In the new paper, the Balandin group reports using a chemical process that could be scaled up for mass production of these one-dimensional materials.

Doctoral student Zahra Barani and Fariboz Kargar, a research professor and project scientist with Balandin’s Phonon Optimized Engineered Materials, or POEM Center, synthesized the unique composites by treating the transition metal trichalcogenides, or TaSe3, a layered van der Waals material with a quasi-one dimensional crystal structure, with chemicals that caused it to shed needle-like, quasi-1D van der Waals nanowires with extremely large aspect ratios of up to ~106— massively longer than thick. In previous research, the group discovered that bundles of quasi-1D TaSe3 atomic threads can support high-current densities. 

“There was no standard recipe for exfoliation of these materials. I did many trial and error experiments, while checking the cleavage energy and other important parameters to exfoliate them with high yield. I knew that the key is to get bundles with as high aspect ratio as I can, since EM waves couple with longer and thinner strands better. That required optical microscopy and scanning electron microscopy characterization after each exfoliation step,” first-author Barani said.

The researchers filled a matrix made from a special polymer with bundles of the exfoliated TaSe3 to produce a thin, black film. The synthesized composite films, while remaining electrically insulating, demonstrated exceptional performance in blocking electromagnetic waves. The polymer composites with low loadings of the fillers were especially effective. 

“The electromagnetic shielding effectiveness of composites is correlated with the aspect ratio of the fillers. The higher the aspect ratio, the lower the filler concentration needed to provide significant EM shielding,” Kargar said. “This is beneficial, since by lowering the filler content one would take advantage of inherent properties of polymers such as light weight and flexibility. In this regard, I can say this class of materials are exceptional once they are exfoliated properly, controlling the thickness and length.” 

“In the end, I got them right, prepared a composite and measured the EMI properties. The results were amazing: no electric conductivity but more than 99.99% of EMI shielding for micrometer thick films,” Barani added.

The quasi-1D van der Waals metallic fillers can be produced inexpensively and in large quantities. Balandin said that research on atomic bundles of quasi-1D van der Waals materials as individual conductors, and composites with such materials is just beginning. 

“I am sure we will soon see a lot of progress with quasi-1D van der Waals materials, as happened with quasi-2D materials,” he said.  

Barani, Kargar, and Balandin were joined in the research by Yassamin Ghafouri, Subhajit Ghosh, Konrad Godziszewski, Saba Seyedmahmoudbaraghani, Yevhen Yashchyshyn, Grzegorz Cywiński Sergey Rumyantsev, and Tina T. Salguero. The paper, “Electrically-Insulating Flexible Films with Quasi-One-Dimensional van-der-Waals Fillers as Efficient Electromagnetic Shields in GHz and Sub-THz Frequency Bands,” is available here.

Related

Source: UC Riverside

Recent Posts

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

10.11.2025
26

Transformer Safety IEC 61558 Standard

7.11.2025
12

ESR of Capacitors, Measurements and Applications

7.11.2025
51

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
54
Image credit: Samtec

How to Match the Right Connector with Protocol Requirements

6.11.2025
14

Transformer Design Optimization for Power Electronics Applications

4.11.2025
23

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

3.11.2025
29

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
28

Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

30.10.2025
18

Upcoming Events

Nov 12
11:00 - 12:00 CET

PCB Design: Impedance is for everyone!

Nov 12
November 12 @ 12:00 - November 13 @ 14:15 EST

Microelectronic Packaging Failure Modes and Analysis

Nov 13
11:00 - 11:30 CET

DC/DC Converters in Automotive Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version