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    Samsung Electro-Mechanics Releases High-Capacitance MLCCs for AI Server Applications

    Samsung Electro-Mechanics Releases 165C Automotive 0806 Size Power Inductors

    Coupled Inductors Circuit Model and Examples of its Applications

    Würth Elektronik Introduces LTspice Models for ESD Products

    Capacitor Ripple Current Testing: A Design Consideration

    TDK Releases 0201 High-Frequency Smallest Inductors

    Coilcraft Extends Air Core RF Inductors

    Bourns Releases Automotive 1W Flyback Transformer

    Wk 20 Electronics Supply Chain Digest

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Rigid Flexible PCB Production Internal Flex Layers

17.12.2024
Reading Time: 2 mins read
A A

This second part of Würth Elektronik PCB webinar on RIGID.flex technology is intended as an introduction to the production of rigid-flex PCBs and covers constructions with internal flex layers.

This video continues WE series and “PCB Production: RIGID.flex”.

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The second part on RIGID.flex technology is intended as an introduction to the production of rigid-flex PCBs and covers constructions with internal flex layers.

And of course, a rigid-flex printed circuit board is also a very complex construct, produced by a large number of sequential processes from a wide variety of materials, which must also be suitable for further processing and the planned application. Understanding this helps in PCB design to be able to successfully implement the requirements from the functional specification in the design and the knowledge equally helps in communicating with the PCB manufacturer.

This webinar series teaches the basics of PCB production and is aimed at PCB designers, buyers, electronics developers and students.

In this webinar you will learn more about

  • The difference in RIGID.flex between buildups with inner and outer flex layers
  • The manufacturing and production processes for rigid-flex with internal flex layers
  • WE advantageous standard stackups
  • Application examples

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