Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

    TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

    TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

PCB Shielding, A Practical Approach

1.7.2025
Reading Time: 4 mins read
A A

In this video Würth Elektronik covers how shielding efficiency is calculated, coupling effects, how to prevent them, and the role of the connector and how it should be connected to the shielding.

Shielding is often the last line of defense for engineers during EMC testing. Learn all about the powers of shielding and what role material selection plays in regards to improving the shielding efficiency.

RelatedPosts

Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

Content

  • Theoretical aspects of shielding
  • Reducing coupling effect
  • The usage of shielding in connectors
  • Shielding materials

Enhancing EMC Compliance through Effective Shielding Strategies

Electromagnetic Compatibility (EMC) is a critical requirement for electronic device reliability. This white paper explores advanced shielding techniques essential for achieving EMC compliance. Highlighting theoretical aspects, practical applications, and common pitfalls, we delve into shielding efficiency, coupling effects, and the strategic use of materials to minimize electromagnetic interference (EMI).

1. Introduction

EMC failures during final product testing are common, often due to inadequate shielding. This paper outlines practical approaches to shielding, emphasizing its role as a final defense against EMI after optimizing PCB layout and filtering techniques.

2. Theoretical Foundations of Shielding

  • 2.1 Basic Principles:
  • Shielding mitigates EMI by reflecting and absorbing electromagnetic waves, governed by material properties such as conductivity and permeability.
  • 2.2 Shielding Efficiency Calculation:
  • Shielding effectiveness (SE) is the sum of absorption loss, reflection loss, and correction factors for multiple reflections:
  • ( SE = A + R + B )
  • Where:
    • A = Absorption loss
    • R = Reflection loss
    • B = Correction factor for re-reflection

3. Coupling Mechanisms and Their Mitigation

  • 3.1 Capacitive Coupling: Reduced by increasing distance, using conductive shielding, and minimizing parallel conductive paths.
  • 3.2 Inductive Coupling: Mitigated through loop area reduction, twisted pair cabling, and magnetic shielding materials.
  • 3.3 Impedance Coupling: Addressed by maintaining continuous ground planes and minimizing discontinuities.

4. Practical Shielding Applications

  • 4.1 PCB Design Considerations:
  • Optimize ground planes, minimize loop areas, and ensure effective via stitching for shielding continuity.
  • 4.2 Cable Shielding Techniques:
  • Employ braided shields, conductive foils, and proper grounding methods to reduce radiated emissions.
  • 4.3 Connector Shielding:
  • Select materials like brass or stainless steel based on mechanical and EMI requirements; ensure low-impedance connections.

5. Challenges with Shielding Apertures

Openings in enclosures can act as unintended antennas. To mitigate this:

  • Keep openings (< \lambda/20) of the wavelength of concern.
  • Utilize honeycomb vents and conductive gaskets.

6. Case Studies and Measurement Insights

Real-world examples demonstrate the impact of shielding techniques on EMC performance, highlighting the importance of proper design and material selection.

7. Conclusion

Effective shielding requires a comprehensive understanding of electromagnetic theory, meticulous PCB design, and strategic material use. Adopting these practices ensures robust EMC performance and product reliability.

Related

Source: Würth Elektronik

Recent Posts

Heatsink Design and Thermal Interface Materials for Reliable Electronics

27.4.2026
377

Würth Elektronik Introduces Lead-Free SMT Spacers

11.2.2026
125

Coaxial Connectors and How to Connect with PCB

17.12.2025
1.4k

PCB Manufacturing, Test Methods, Quality and Reliability

18.6.2026
672

Molex Introduces Modular Wire-to-Wire Automotive Connectors

11.12.2025
91

Murata Releases World’s First Inner Cavity-Structure Ultra-Low-Loss LCP Flexible Substrate

10.12.2025
180

binder expands M8 portfolio with 360° shielded cable connectors

29.10.2025
35

Samtec Expands Connector Severe Environment Testing Offering

10.10.2025
46

Connector PCB Design Challenges

3.10.2025
136

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved