Tag: PCNS

The paper “Protecting the Quality & Reliability of Passive (and Active) Components: the J-STD-075 PSL Classification & Labeling” was presented ...

The paper “New Generation of Metallized Film Capacitors Based on EPN for Solving Upcoming High Temperature and High Power Density ...

The paper “Enhancing E-Textile Reliability: A Comparative Study of SMD-Ribbon Joints Protections Against Sweat” was presented by Martin Hirman, University ...

The paper “Quality Challenges and Risk Mitigation for Passive Components in Harsh Environments” was presented by Antonio Rodríguez Arenas, ALTER ...

The paper “Muratas Silicon Capacitors: Reliable Performance in Extreme Conditions" was presented by Enzo Darcy, Caen, France at the 5th ...

The paper “Tantalum Capacitor Technology Advantages for Harsh Environment” was presented by Michel Bouvier, Vishay Europe, Le Pecq, France at the ...

The paper “Thermoset Polymer Dielectric Capacitors for Harsh Environment Applications ” was presented by Angelo Yializis, PolyCharge America Inc. Tucson, AZ, ...

The paper “AI Hardware Development and Its Consequences for Passive Electronic Components” was presented by Tomas Zednicek, EPCI European Passive Components ...

The paper “Passive Components in AI Systems” was presented by Slavomir Pala, KYOCERA AVX Lanskroun, Czech Republic at the 5th PCNS Passive ...

The paper “Computer Vision‑Driven Verification of Passive Component Assembly on Space‑Grade PCBs” was presented by Carmen Galán,  and Manuel Domínguez, ALTER Technology, Seville, Spain ...