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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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    • Ripple Current
    • RF
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Taiwan Inductors Suppliers Optimistic about 4Q20

24.11.2020
Reading Time: 1 min read
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Taiwan-based inductor makers, including Chilisin Electronics, are expected to enjoy a particularly strong fourth quarter in 2020, bolstered by robust shipments for both handset and non-handset applications, according to industry sources.

Chilisin has seen clear visibility for orders from handset vendors in China and South Korea for small-size molding chokes for four months ahead, the sources said, adding that 5G handsets require the use of 20-30% more molding chokes than 4G models, mainly for RF, anti-EMI (electromagnetic interference), and power supply applications.

RelatedPosts

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Bourns Introduces Precision Thin Film Resistors for Measurement

Chilisin has also registered strong shipments of molding chokes for server, notebook, automotive and networking applications, with its capacity utilization for such segments staying at over 80%.

This year, the company has boosted its monthly capacity for large-size molding chokes to 300 million units from 280 million, and that for small-size ones to 600 million units from 500 million.

Another inductor maker Tai-Tech Advanced Electronics has also completed capacity expansion for molding chokes, mainly for notebook, desktop PC and TV applications, with monthly revenues from these segments sustaining on-year increases of over 20% since March 2020, the sources said.

Chilisin’s October revenues rose 12.78% on year to NT$1.479 billion (US$51.83 million), and January-October revenues gained 9.09% on year to NT$14.389 billion.

Tai-Tech’s October sales expanded 23.75% on year to NT$383 million, and January-October sales spiked 35.31% on year to NT$3.652 billion.

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Source: DigiTimes

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