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    Bourns Extends Rotational Life Option for its Guitar Potentiometer

    Modeling and Simulation of Leakage Inductance

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    TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

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Tantalum Polymer Capacitors: Hermetic Packaging Solutions for Space Applications

2.3.2018
Reading Time: 2 mins read
A A

source: AVX Corporation, EPCI e-Symposium

Abstract:

RelatedPosts

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Power Inductor Considerations for AI High Power Computing – Vishay Video

In common with commercial applications, demand for established reliability solutions with higher bulk capacitance and lower ESR continues, along with the need for increasing the volumetric efficiency and reducing real estate / payload. Interestingly, voltage trends remain fairly stable within avionics and aerospace as common bus voltages from 5v to 28v remain unchanged; however, there remain a number of higher voltage applications (48v+), while the number of lower voltage applications requiring regulated power in the 1.5v to 3.3v range (as higher speed ASICs and CPUs are introduced) continue to increase.

One technology that has emerged as being a common solution for high bulk capacitance and very low ESR across a wide span of voltage ratings is tantalum conductive polymer. Originally introduced as a purely commercial technology, molded conductive polymer technology has advanced to the point where it can meet the environmental requirements of automotive qualifications (AEC-Q200) and is amenable to high reliability conditioning associated with flight applications, including voltage aging and surge test.

This paper discusses the technology behind, and characterization of, the latest developments in hermetically sealed surface mount low ESR conductive polymer capacitors for aerospace applications, that ensure high long-term parametric stability over a wide working voltage range. Examples are given of their use in a variety of applications, from pulse power to high speed switching circuits in mission critical applications.


Title: Tantalum Polymer Capacitors: Hermetic Packaging Solutions for Space Applications
Authors: Chris Reynolds
Organisation(s): AVX Corporation
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: article 5.3., PCNS2017 Proceedings Pg.107-112
ISBN: 978-80-905 768-8-9
e-Sessions  Applications: Aerospace
e-Sessions Scope Components: Capacitors
e-Sessions Topics: Quality & Reliability, Technology


read the full paper in pdf here

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