Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK EMC components: Miniaturized LC filters for suppression of EMI

8.3.2017
Reading Time: 2 mins read
A A

source: TDK news

Mar. 7, 2017. TDK Corporation presents the MEM1005PP251T – a new LC filter for EMI suppression. With dimensions of just 1.0 x 0.5 x 0.35 mm the filters are ideally suited for use in smart phones and base stations. Volume production began in March 2017.

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

Samtec Expands Offering of Slim, High-Density HD Array Connectors

The usual method for suppressing interference in the communication frequency bands of smart phones and other devices is to use capacitors or inductances, or a combination of these components. In contrast to discrete solutions, the MEM1005PP251T combines two capacitors and an inductance in the form of a Pi filter in a single component. As a result, 61 percent less space is required and there is a reduction in the overall number of components.

Thanks to the special design by TDK, the component offers very low-loss operation and a DC resistance of just 0.8 Ω, which represents a reduction of 69 percent when compared to previous products. The new filter offers a rated current of 350 mA, which is 3.5 times more than the MEM1608P series. With these properties the combination element offers the highest possible performance currently available in its class.* In addition, the new filter is designed for a very wide temperature range from -55 °C to +125 °C, whereas previous series only covered the range from -40 °C to +85 °C. Due to expansion of rated current and the wide temperature range, it allows a high degree of design flexibility.

The attenuation in the frequency range from 700 MHz to 3 GHz, which is used by mobile communications, is in excess of 30 dB. This means that interference is extremely well suppressed and the reception sensitivity increases significantly.

In future, TDK will extend this product line to meet the design requirements for a broad spectrum of devices for wireless communication.

*Status: March 2017 according to studies by TDK

Main applications

  • Smart phones, Tablet PCs and game consoles with communication function equipped
  • Base stations

Main features and benefits

  • High degree of noise suppression of over 30 dB in the mobile radio frequency range
  • Significant increase in the reception sensitivity of communication equipment
  • Footprint reduced by 61 percent compared to existing products and reduction of implementation cost
  • Low DC resistance and therefore low loss
  • High flexibility of design thanks to high permissible rated current

Key data

Type Cutoff frequency
[MHz]
DC impedance
[Ω]
Rated current [mA] Maximum voltage
[V]
MEM1005PP251T 250 typ. 0.8 max. 350 max. 10

Related

Recent Posts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
13

Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

30.10.2025
7

Vishay Releases Space-Grade 150 W 28V Planar Transformers

29.10.2025
15

How to Select Ferrite Bead for Filtering in Buck Boost Converter

23.10.2025
42

Power Inductors Future: Minimal Losses and Compact Designs

30.10.2025
53

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

22.10.2025
9

Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

30.10.2025
55

Murata Integrates Component Models into Cadence EDA Tools

21.10.2025
48

Bourns Releases High Inductance Common Mode Choke

16.10.2025
24

Bourns Releases High Clearance and Creepage 1500VDC Power Transformer

15.10.2025
29

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version