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    source: Samtec

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    DigiKey Presents Factory Tomorrow Season 5 Video Series

    Samsung MLCCs Lineup for In-Vehicle Infotainment

    source: Samtec

    Best Practices for Cable Management in High-Speed and High-Density Systems

    Würth Elektronik Unveils Compact Common-Mode Data Lines Chokes

    Bourns Releases TCO 240 Watt USB Mini-Breaker

    Littelfuse Adds 600W Automotive TVS Diodes for High-Energy Transient Protection

    Vishay Releases Harsh Environment Robust DC-Link Film Capacitor

    Bourns Releases Automotive High Creepage and Clearance Transformer

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

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    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

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TDK Releases 0201 High-Frequency Smallest Inductors

20.5.2025
Reading Time: 2 mins read
A A

    TDK Corporation announced expansion of the MUQ0201022HA series of high-frequency 0201 SMD inductors.

    The 0201 size (0.25 x 0.125 x 0.2 mm; L x W x T) are the smallest SMD inductors of their kind in the industry with the same electrical characteristics as the existing MHQ0402PSA series, which is one size larger at 0402 (0.4 x 0.2 mm; L x W).

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    The lineup covers an inductance from 0.6 nH to 3.6 nH. Mass production of these new components began in May 2025.

    As mobile devices such as smartphones and wearable devices become increasingly sophisticated and compact, there is a growing need for small-sized, high-performance components.

    By applying its proprietary patterning and sintering technologies, TDK has achieved high-frequency characteristics equivalent to or better than existing products while reducing the component mounting area by around half.

    TDK will further expand its line to meet the needs of customers.

    Features

    • Achieves high-frequency characteristics equivalent to or better than existing products that are one size larger by applying TDK’s own proprietary patterning and sintering technologies
    • Maintains the same characteristics while reducing mounting area to around half the size of a 0402 mm inductor

    Applications

    • Impedance matching for high-frequency front-end modules for mobile devices
    • Impedance matching for wearable devices

    Related

    Source: TDK

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