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    KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

    When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Wk 16 Electronics Supply Chain Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

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    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

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TDK Releases 0201 High-Frequency Smallest Inductors

20.5.2025
Reading Time: 2 mins read
A A

    TDK Corporation announced expansion of the MUQ0201022HA series of high-frequency 0201 SMD inductors.

    The 0201 size (0.25 x 0.125 x 0.2 mm; L x W x T) are the smallest SMD inductors of their kind in the industry with the same electrical characteristics as the existing MHQ0402PSA series, which is one size larger at 0402 (0.4 x 0.2 mm; L x W).

    RelatedPosts

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

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    TDK and Nippon Chemical Launch Joint Venture for MLCC Materials

    The lineup covers an inductance from 0.6 nH to 3.6 nH. Mass production of these new components began in May 2025.

    As mobile devices such as smartphones and wearable devices become increasingly sophisticated and compact, there is a growing need for small-sized, high-performance components.

    By applying its proprietary patterning and sintering technologies, TDK has achieved high-frequency characteristics equivalent to or better than existing products while reducing the component mounting area by around half.

    TDK will further expand its line to meet the needs of customers.

    Features

    • Achieves high-frequency characteristics equivalent to or better than existing products that are one size larger by applying TDK’s own proprietary patterning and sintering technologies
    • Maintains the same characteristics while reducing mounting area to around half the size of a 0402 mm inductor

    Applications

    • Impedance matching for high-frequency front-end modules for mobile devices
    • Impedance matching for wearable devices

    Related

    Source: TDK

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