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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

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    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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TDK Releases 0201 High-Frequency Smallest Inductors

20.5.2025
Reading Time: 2 mins read
A A

    TDK Corporation announced expansion of the MUQ0201022HA series of high-frequency 0201 SMD inductors.

    The 0201 size (0.25 x 0.125 x 0.2 mm; L x W x T) are the smallest SMD inductors of their kind in the industry with the same electrical characteristics as the existing MHQ0402PSA series, which is one size larger at 0402 (0.4 x 0.2 mm; L x W).

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    The lineup covers an inductance from 0.6 nH to 3.6 nH. Mass production of these new components began in May 2025.

    As mobile devices such as smartphones and wearable devices become increasingly sophisticated and compact, there is a growing need for small-sized, high-performance components.

    By applying its proprietary patterning and sintering technologies, TDK has achieved high-frequency characteristics equivalent to or better than existing products while reducing the component mounting area by around half.

    TDK will further expand its line to meet the needs of customers.

    Features

    • Achieves high-frequency characteristics equivalent to or better than existing products that are one size larger by applying TDK’s own proprietary patterning and sintering technologies
    • Maintains the same characteristics while reducing mounting area to around half the size of a 0402 mm inductor

    Applications

    • Impedance matching for high-frequency front-end modules for mobile devices
    • Impedance matching for wearable devices

    Related

    Source: TDK

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