Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

    Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

    Lightweight Model for MLCC Appearance Defect Detection

    DMASS Reports First Positive Signs of European Distribution Market in Q3/25

    TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

    Wk 44 Electronics Supply Chain Digest

    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Thermocouple physics – How it works

4.10.2016
Reading Time: 3 mins read
A A

source: EDN article

Martin Rowe -October 02, 2016
Early in my editorial career, I wrote an article about thermocouples in Test & Measurement World where I incorrectly said that a voltage proportional to the junction temperature develops across the junction of two dissimilar metals. A reader wrote me a detailed letter (on paper, no e-mail then) explaining the Seebeck effect. Ever since, whenever I see anything about thermocouples using the incorrect description, I realize that yet another author is perpetuating the same old error.

RelatedPosts

Microhardness — the Hidden Key to Understanding MnOx Cathode Quality in Tantalum Capacitors

Samsung to Invest in its Philippine MLCC Facility to Meet Automotive Demand

Lightweight Model for MLCC Appearance Defect Detection

When Gordon Lee sent me his article Thermocouples: Basic principles and design essentials, I immediately looked for how he described thermocouple physics. He got it right. Jim Williams, however, made the same mistake I made.

While skimming through some EDN print issues, I ran across a letter to the editor written by Bill Dubé in the September 1, 1988 issue (Signals and noise, p.32). Dubé pointed out that Jim Williams made the same mistake in an article on thermocouple circuits from the May 26, 1988 issue, Clever techniques improve thermocouple measurements. EDN’s editors notified Williams of the letter. Jim did his homework and replied that he indeed got it wrong. See the text of the letter below, reprinted from the September 1 issue.

Some 20+ years after I made the same mistake, I feel exonerated, even though two wrongs don’t make a right (except in digital logic).

Thermocouple misconceptions are common

Jim Williams’s fine article “Clever techniques improve thermocouple measurements” (EDN, May 26, 1988, pg 145) is sadly flawed by a basic misunderstanding of the physics of thermocouples. It is a common misconception that the voltage of a thermocouple is generated across the junction. This is simply not true. The voltage is generated along the wires and is driven by the temperature difference between the sensing junction and the reference (“cold”) junction. For a given temperature difference, the two dissimilar wires generate unequal voltages. The voltage appearing across the thermocouple circuit at the reference junction is the difference between these unequal voltages.

The more technical explanation is that for a given temperature gradient dT/dx, an electric field dV/dx is generated. This electric field is a function of both dT/dx and absolute temperature. The local value of the difference dV/dT for a given alloy pair at a particular temperature is called the Seebeck coefficient. If the integral of the Seebeck coefficient is evaluated between-the sensing junction and the reference junction, the thermoelectric voltage results.

Thermal voltages in thermocouple circuits are always the result of thermal gradients. If a section of a thermocouple circuit has an unknown or undesirable Seebeck coefficient, then its influence can be diminished by suppressing thermal gradients in that section. For example, when you make a connection in a thermocouple circuit, it’s best to thermally anchor each of the wires to a common temperature before they reach the electrical connection point. The connection point should also be thermally anchored to this temperature. This procedure tends to suppress thermal gradients across the oxides, unknown alloys, etc, that make up the connection. If the thermal gradients are sup pressed, spurious thermal voltages will be reduced.

I hope this explanation will help clear up some of the misconceptions about the physics of thermocouples. Jim Williams is not alone in his misunderstanding—I have seen a remarkably similar treatment of thermocouples in a high-school physics text that is currently being used by the Denver School Dept.

Bill Dubé
Mechanical Engineer Denver, CO

 

Jim Williams responds:
Some friends and I have reviewed Bill Dubé’s comments and found them to be quite correct. As such, I find myself corrected, educated, and apologizing for any confusion I may have caused EDN’s readers. Although Bill’s distinctions are subtle, they are still the more correct interpretation, and I appreciate his remarks.

Related

Recent Posts

Lightweight Model for MLCC Appearance Defect Detection

3.11.2025
1

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
40

Enhancing Energy Density in Nanocomposite Dielectric Capacitors

9.10.2025
44
a Schematic diagram of the BNT-based components constructed based on the entropy-increase strategy. b Digital photograph, cross-sectional SEM image, and EDS mappings of the MLCCs. c Unipolar P-E loops of MLCCs as a function of applied E. d Wrec and η of the MLCCs as a function of applied E. The comparison of (e) Wrec and η, (f) η and UF of the MLCCs with those of other recently reported state-of-the-art MLCCs. source: Nature Communications

Researchers Proposed Enhanced Energy Storage MLCC

1.10.2025
27

Development of Nitrogen-Doped Graphene Supercapacitors 

30.9.2025
19

Efficient Power Converters: Duty Cycle vs Conduction Losses

29.9.2025
52

Researchers Developed Reduced Graphene Oxide (rGO) High Energy Density Graphene Supercapacitors

18.9.2025
41

Researchers Enhanced 2D Ferromagnets Performance

16.9.2025
9

DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

27.8.2025
16

Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

19.8.2025
21

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version