Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Top 10 Connector Vendors by Product Type

    Bourns Releases High‑Q Air Coil Inductors for RF Aplications

    CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

    ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

    Würth Elektronik Offers Halogen‑Free EMC Gaskets for Displays and Housings

    Component Distribution Supply Chain January 2026

    Binder Unveils M8 Flange Solder Connectors for Flexible Cabling

    Power Electronics Tools for Passives and Magnetic Designs

    Modelithics Releases Component Model Library for SIMULIA CST Studio Suite

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Top 10 Connector Vendors by Product Type

    Bourns Releases High‑Q Air Coil Inductors for RF Aplications

    CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

    ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

    Würth Elektronik Offers Halogen‑Free EMC Gaskets for Displays and Housings

    Component Distribution Supply Chain January 2026

    Binder Unveils M8 Flange Solder Connectors for Flexible Cabling

    Power Electronics Tools for Passives and Magnetic Designs

    Modelithics Releases Component Model Library for SIMULIA CST Studio Suite

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

UNIST Introduces Tiny Micro Supercapacitor On Chip, Ideal for Wearable Devices

18.3.2020
Reading Time: 3 mins read
A A

A tiny microsupercapacitor (MSC) that is as small as the width of a person’s fingerprint and can be integrated directly with an electronic chip has been developed. This has attracted major attention as a novel technology to lead the era of Internet of Things (IoT) since it can be driven independently when applied to individual electronic components.

Through the study, Professor Sang-Young Lee and his research team in the School of Energy and Chemical Engineering at UNIST have unveiled a new class of ultrahigh areal number density solid-state MSCs (UHD SS–MSCs) on a chip via electrohydrodynamic (EHD) jet printing. According to the research team, this is the first study to exploit EHD jet printing in the MSCs.

RelatedPosts

Top 10 Connector Vendors by Product Type

Bourns Releases High‑Q Air Coil Inductors for RF Aplications

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

A supercapacitor (SC), also known as an ultracapacitor, can store much more energy than ordinary capacitors. The benefits ofsupercapacitors include having high power delivery and longer cycle life compared to lithium-based secondary batteries. In particular, it can be produced as small as the width of a person’s fingerprint via semiconductor manufacturing process, and thus can be also applicable for wearables and internet of things (IoT) devices.

However, because the heat produced in manufacturing process may cause deterioration of the electrical characteristics of the supercapacitor, it has been difficult to connect them directly to electronic components. In addition, the fabrication method that combines supercapacitors with electronic components via inkjet printing technique has also the disadvantage of lower precision.

The overall fabrication of on-chip UHD SS–MSCs is schematically illustrated above.

The research team solved this issue using EHD jet printing, a high-resolution patterning technique in microelectronics. EHD jet printing uses the electrode and electrolyte for printing purpose similar to that of conventional inkjet printing, yet it can control printed liquid with an electric field.

“We were able to produce up to 54.9 unit cells per square centimeter via electro-hydrodynamic jet printing technique, and thus the output of 65.9 volts (V) was achieved in the same area,” says Kwonhyung Lee (Combined M.S/Ph.D. of Energy and Chemical Engineering, UNIST), the first author of the study.

On-chip UHD SS–MSCs as a device-unitized power source.

The team also succeeded in fabricating 36 unit cells on a chip (area = 8.0 mm × 8.2 mm, 54.9 cells cm−2) and areal operating voltage (65.9 V cm−2) that lie far beyond those of previously reported MSCs fabricated by printing techniques. Besides, upon exposure to hot temperature (80°C), these cells maintained normal cyclic voltammetry (CV) profiles, and thus has proven they can withstand excessive heat generated during the operation of actual electronic component. In addition, these batteries can provide customized power supplies, as they can be connected either in series or parallel.

“In this study, we have demonstrated on-chip UHD SS–MSCs fabricated via EHD jet printing,” says Professor Lee. “The on-chip UHD SS–MSCs presented here hold great promise as a new platform technology for miniaturized monolithic power sources with customized design and tunable electrochemical properties.”

This study has been supported through the Mid-career Researcher Supporting Program by the Ministry of Science and ICT (MSIT, Korea) and the Industry Technology Development Program funded by the Ministry of rade, Industry and Energy (MOTIE, Korea). The findings of this work have been published in the scientific journal, Science Advances on March 6, 2020.

Journal Reference
Kwon-Hyung Lee, Seong-Sun Lee, David B. Ahn, et al., “Ultrahigh areal number density solid-state on-chip microsupercapacitors via Electrohydrodynamic Jet-Printing,” Science Advances, (2020).

Related

Source: UNIST

Recent Posts

CMSE 2026 Announces Call for Presentations on High-Reliability Military and Space Electronics

28.1.2026
17

ESA Call for Papers 6th Space Passive Component Days – SPCD 2026

28.1.2026
16

Power Electronics Tools for Passives and Magnetic Designs

27.1.2026
33

Exxelia Publishes Micropen White Papers for Printed Electronics

26.1.2026
28

Samsung Q4 2025 Results: MLCC focus for AI, Server and Automotive

26.1.2026
49

Würth Elektronik Developed a Custom Transformer for Active Hand Orthosis

26.1.2026
34

Capacitor Technology Dossier

26.1.2026
70

Passive Components in Quantum Computing

22.1.2026
121

Miniaturization of MLCCs and Electrolytics, KAVX Tech Chat

21.1.2026
67

Upcoming Events

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • How Metal Prices Are Driving Passive Component Price Hikes

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Degradation of Capacitors and its Failure Mechanisms

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version