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    Wk 42 Electronics Supply Chain Digest

    Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

    September 2025 ECIA US Components Sales Sentiment Continues in Optimism

    Bourns Release Automotive 4-Terminal Shunt Resistors

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    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

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Wk 25 Electronics Supply Chain Digest

24.6.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 6-21-24.

DATAPOINT OF THE WEEK: S&P reported US June flash mfg PMI of 51.7 vs 51.3 in May reflecting strengthening in new orders to a three-month high, partially offset by a more modest growth in output; outlook among US manufacturers weakened however to the lowest in 18 months over demand concerns and election-related uncertainty.

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For Europe S&P reported manufacturing conditions weakened with June flash PMI of 45.6 vs 49.3 in May, marking a 6-month low due to renewed fall in new orders and output. For Japan flash mfg PMI stood at 50.1 in June vs 50.4 in May reflecting a stall in momentum according to S&P.

Headlines:

Auto

  • Chinese automakers retain grip over Southeast Asia’s booming electric car market
  • EV startup Fisker files for bankruptcy, aims to sell assets
  • German top industrial union to demand 7% pay rise from Volkswagen
  • Nissan halts production at Changzhou plant as China woes persist
  • Ford plans further job cuts in Europe, German works council says

Industrial/Aerospace

  • Japan core machinery orders down in April for first time in three months
  • China’s factory output disappoints, property sector stuck in doldrums

Datacenter

  • Oracle to invest over $1 bln on AI, cloud computing in Spain

Semiconductors

  • onsemi releases 7th generation IGBT modules for renewable energy applications
  • TSMC plans to raise prices for 3nm foundry and advanced packaging
  • Wolfspeed delaying plans to build SiC plant in Germany
  • onsemi to invest $2B in SiC back-end capacity expansion in Europe
  • US wants Netherlands, Japan to further restrict chipmaking equipment to China
  • STM maintains top SiC market share in 2023, onsemi jumps to number two, says TrendForce
  • SMIC and Huawei successfully developed 5nm technology says Chinese media
  • Samsung delays further its Texas fab
  • Vishay completes construction of its second fab in Itzehoe

Other

  • 2Q24 global smartphone production projected to decline 5-10% Q/Q due to elevated channel inventories says TrendForce

Related

Source: Edgewater Research

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