Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces High‑Current Y2/X1 Film Capacitors for Wide-bandgap Power Systems

    Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems

    Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing

    YAGEO Introduces High Rel MLCCs Beyond MIL-Spec Limits

    Würth Elektronik Expanded Capacity for Validation and Services in Asia

    Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains

    YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook

    TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters

    Vishay Extends Power Inductors for DC/DC with 1212 Compact Case

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Würth Elektronik Supports European Hyperloop Teams

29.7.2021
Reading Time: 3 mins read
A A

A keynote by Alexander Gerfer, CTO at Würth Elektronik eiSos Group, on July 20 opened the first European Hyperloop Week Conference Week in Valencia. Alongside the Hyperloop Pod Competition, Würth Elektronik participated in numerous roundtable discussions with development teams and leaders from the Hyperloop scene throughout the week.

Hyperloop Week came to Europe for the first time this year. In 2014, the concept of the Hyperloop mobility was unveiled by Elon Musk and showcased at the SpaceX site in Los Angeles County, U.S.A. Four Hyperloop teams, HYPED from the University of Edinburgh, Swissloop ETH Zurich, Hyperloop UPV Valencia, and Delft Hyperloop, were the organizers behind the first European Hyperloop Week.

RelatedPosts

Würth Elektronik Expanded Capacity for Validation and Services in Asia

Würth Elektronik Releases Heat Sinks for TO and IC packages

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

With the assistance of components and technical backing, Würth Elektronik has supported three of these teams for a long time. Another team recently joining is Centro Superior de Innovación y Desarollo CHF, Madrid. Würth Elektronik also supported the European Hyperloop Week as a Gold Partner.

“How to make your idea happen – even small challenges can become a show stopper for your idea. Learn how to make sure of your success,” states Alexander Gerfer, CTO at Würth Elektronik eiSos Group, as he began his keynote and opened the assembly dedicated to electronics and mechanics on July 20.

Partner for future technologies

“We invest in the development of future technologies, also as a partner of the first European Hyperloop Week. We have been supporting three teams for years by providing components, EMC tests and expertise. We want to encourage young talents and enable them to realize their ideas and make them ready for market,” says Gerfer.

Würth Elektronik participated in the roundtable discussions on “Future transportation in Spain” and “Problems facing future transportation / future of Hyperloop”. Jorge Victoria, Senior Product Manager EMC Shielding & Thermal Materials, Product Management at Würth Elektronik eiSos, in collaboration with the Fundación Cátedra, conducted EMC testing and analysis, containment, and heat loss reduction tests for the Hyperloop pods from the organizing teams in the joint laboratories at the Universidad Politècnica de València.

Competition and awards in various categories

On Saturday, July 24, 2021, 34 student teams from around the world competed for the best performance in various disciplines on specially built transport tracks at the Circuito Ricardo Tormo de Valencia racetrack. The overall winner with the best “pod” was Team Swissloop from ETH Zurich.

At the gala dinner at the end of the week, awards were presented in various categories. Würth Elektronik sponsored the award for best thermal management design. Jorge Victoria and Josep Balcells Orona, Country Manager Würth Elektronik Spain, presented this award to Team Swissloop from ETH Zurich. On Sunday, July 25, the public had the opportunity to look at the pods and find out more about Hyperloop. A team from Würth Elektronik was on site as a point of contact in the “La Marina” port zone in Valencia and answered questions from interested visitors.

Related

Source: Würth Elektronik

Recent Posts

Würth Elektronik Expanded Capacity for Validation and Services in Asia

16.4.2026
9

KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD

16.4.2026
24

Murata Automotive MLCCs Push Capacitance Limits for ADAS and Power Lines

16.4.2026
44

Würth Elektronik Releases Heat Sinks for TO and IC packages

31.3.2026
27

Würth Elektronik Unveils High-Current Automotive Power Inductor

16.4.2026
41

Würth Elektronik Presents Differential Pressure Sensor for HVAC and Medical

17.3.2026
21

Würth Elektronik and Grinn Launch Edge AI Cooperation

13.3.2026
30

Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance

10.3.2026
60

Kyocera Releases 30fs Jitter Differential Clock Oscillator

10.3.2026
22

Upcoming Events

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

Apr 22
17:00 - 17:30 CEST

Magnetics in a high frequency GaN era

Apr 22
17:00 - 18:00 CEST

Derating Tantalum, Film, and Ceramic Capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Plastic Materials Dielectric Constant and DF

    4 shares
    Share 4 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version