Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Source: Semiconductor Intelligence

    October 25 Electronics Production: U.S. vs. Global Changes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Source: Semiconductor Intelligence

    October 25 Electronics Production: U.S. vs. Global Changes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

AVX To Present Paper on Advances In High-Reliability Conductive Polymer Capacitors at MRQW 2018

23.1.2018
Reading Time: 2 mins read
A A

source: AVX news

The 2018 Microelectronics Reliability & Qualification Working Meeting (MRQW) will take place February 6–8 & will address various topics concerning the reliability & qualification of microelectronics targeted for use in space systems
FOUNTAIN INN, S.C. (January 18, 2018) – AVX Corporation, a leading manufacturer and supplier of passive components and interconnect solutions, will present a technical paper about advances in high-reliability conductive polymer capacitors for space applications at the 2018 Microelectronics Reliability and Qualification Working Meeting (MRQW), which will take place February 6–8 in El Segundo, California.

RelatedPosts

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

Samtec Expands Offering of Slim, High-Density HD Array Connectors

Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

Sponsored by The Aerospace Corporation, supported by NASA and NASA’s Jet Propulsion Laboratory, and designed for reliability engineers, radiation-effects engineers, and microelectronic technology developers and parts procurement professionals, MRQW provides a forum for the open discussion of microelectronics reliability and qualification issues for microelectronics targeted for use in space systems. The 2018 format will consist of two and a half days of meetings with multiple technical sessions and two keynote speakers, in addition to several networking opportunities, and will address topics including: advanced technology reliability issues, product qualification methodology, advanced space microprocessors and memories, RF/analog/mixed-signal device and design issues, space radiation effects, FPGA reliability and qualification issues, hardness-by-design, reliability for extreme environments, advanced packaging issues, failure analysis, optoelectronics, GaN reliability and radiation effects, and emerging technologies.

AVX Fellow Ron Demcko will present “Advances in High-Reliability Conductive Polymer Capacitors” at 11:00am on Tuesday, February 6.

“MRQW is an annual event that facilitates in-depth technical discussions about emerging technologies that are applicable to spacecraft electronics. Early identification, understanding, and optimization of these technologies allows for more powerful and reliable flight electronics and ultimately impacts terrestrial electronics via the adoption of improved technologies,” said Demcko. “AVX welcomes the opportunity to present on the technologies we’ve developed to drive system performance across multiple sectors.”

Related

Recent Posts

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

30.10.2025
1

Capacitor Self-balancing in a Flying-Capacitor Buck Converter

30.10.2025
1

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
3

Vishay Releases Space-Grade 150 W 28V Planar Transformers

29.10.2025
7

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
23

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

23.10.2025
42

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
38

Murata Integrates Component Models into Cadence EDA Tools

21.10.2025
46

September 2025 ECIA US Components Sales Sentiment Continues in Optimism

20.10.2025
23

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
31

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version