Hirose releases new stacking height variations to its BK13 series, board-to-FPC connectors with enhanced space efficiency and functionality for consumer...
Read moreDetailsHirose Electric Co., Ltd. has introduced the FH80 backflip FPC board to board connector, featuring the industry’s lowest profile height...
Read moreDetailsThe SGeT Harmonized FPGA Module (HFM) standard, announced by Samtec in 2024, aims to standardize FPGA-based System-on-Modules (SoMs). It proposes...
Read moreDetailsThis article is based on a blog post by Samtec that explores the concept of tolerance stack-up and the mating...
Read moreDetailsThe new KYOCERA AVX 9258 series spring-finger board-to-board compression contacts provide OEMs across industries with a competitive combination of flexibility,...
Read moreDetailsHirose Electric introduces its FH79 Series of 0.3mm Pitch FPC (Flexible Printed Circuit) board to board connectors ideal for automotive...
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© EPCI - Leading Passive Components Educational and Information Site