Board to Board connectors news

Kyocera Launches 5908 Series: Fully Shielded Board-to-Board Connectors for High-Speed, EMI-Resilient Applications. Kyocera Corporation has introduced the 5908 Series, a...

Samtec is excited to introduce the newest members of its AcceleRate HP® high-performance array family: 800-position APM6, APF6 at a 5 mm stack height.   The...

Hirose Electric unveils industry leading high current vibration-resistant connectors for the EV and HEV Markets. Hirose Electric Co., Ltd. announced...

Hirose Electric unveils FH76 series: revolutionizing ultra-low-profile FPC connectors for compact devices. Hirose Electric Co., Ltd., a global leader in...

Hirose introduces FH81 series with one action and top & bottom contact connectors that improve design flexibility and workability in...

Hirose releases new stacking height variations to its BK13 series, board-to-FPC connectors with enhanced space efficiency and functionality for consumer...

Hirose Electric Co., Ltd. has introduced the FH80 backflip FPC board to board connector, featuring the industry’s lowest profile height...

The SGeT Harmonized FPGA Module (HFM) standard, announced by Samtec in 2024, aims to standardize FPGA-based System-on-Modules (SoMs). It proposes...

This article is based on a blog post by Samtec that explores the concept of tolerance stack-up and the mating...

The new KYOCERA AVX 9258 series spring-finger board-to-board compression contacts provide OEMs across industries with a competitive combination of flexibility,...