Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

27.4.2026
Reading Time: 6 mins read
A A

Murata has introduced a new bulk case packaging format for ultra‑small multilayer ceramic capacitors (MLCCs) that dramatically reduces packaging material while increasing packing density in SMT production.

The Murata concept targets both environmental impact and factory productivity, especially for high‑volume lines using 01005‑inch and 0201‑inch MLCC ceramic capacitors.

RelatedPosts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

Murata Expands Automotive Metal Power Inductor Range

Key features and benefits

Bulk case concept

  • New dedicated case that holds loose MLCCs which are then fed to the placement machine via a bulk feeder instead of conventional tape‑and‑reel.
  • Specifically released for ultra‑small MLCC sizes 01005‑inch (0.4 mm × 0.2 mm) and 0201‑inch (0.6 mm × 0.3 mm).
  • Designed as an additional packaging option alongside traditional taping, not a full replacement.

Environmental and logistics benefits

  • Up to approximately 99% reduction in packaging material weight compared to Murata’s conventional taping when packing 10,000 pieces of 0201‑inch MLCCs.
  • Significant decrease in plastic and paper consumption, helping OEMs and EMS providers address internal sustainability targets and regulatory pressure.
  • Reduced greenhouse gas emissions associated with manufacturing, transporting, and disposing of reels and other packaging materials.
  • Lower exposure to waste‑related compliance costs such as disposal taxes, incineration fees, and potential carbon‑linked charges.

Factory productivity and handling

  • For 01005‑inch MLCCs, each bulk case can hold 500,000 components versus 20,000 components per tape reel, consolidating the equivalent of 25 reels into one case.
  • For 0201‑inch MLCCs, each bulk case holds 150,000 components, approximately 10 times the capacity of conventional packaging.
  • Fewer changeovers and material replenishments on high‑speed lines, which can reduce downtime and operator workload.
  • Reduced storage volume for the same component count, simplifying warehousing and material handling.
  • Fewer internal transport operations within the plant thanks to higher packing density.

Typical applications

The bulk case packaging does not change the electrical characteristics or qualification status of the MLCCs themselves; it changes how they are supplied to manufacturing. Relevant use cases are driven by volume, size, and automation level.

Where this packaging is most attractive

  • High‑volume consumer electronics production using 01005 and 0201 capacitors (smartphones, wearables, tablets, compact IoT nodes).
  • Dense automotive ECUs and ADAS modules where ultra‑small MLCCs are used to save PCB area and weight, and where large reels of tiny parts complicate logistics.
  • Network and telecom equipment with very high MLCC counts per board where feeding stability and replenishment frequency are critical.
  • Industrial and medical electronics with stringent sustainability targets, where a quantifiable reduction in packaging waste supports ESG reporting.

When to consider staying with tape‑and‑reel

  • Low‑ to medium‑volume builds where the complexity of adding bulk feeders may not be justified.
  • Lines without access to bulk‑compatible feeders or where SMT platforms are locked to tape‑and‑reel only.
  • Product series and processes where Murata indicates that bulk case is not yet qualified or released for mass use; this must be confirmed series by series.

Technical highlights

Supported MLCC sizes and capacities

MLCC case sizeApprox. metric size (mm)Units per bulk caseRelative to tape‑and‑reel capacity
01005‑inch0.4 × 0.2500,000~25× a 20,000‑piece reel
0201‑inch0.6 × 0.3150,000~10× typical reel capacity
  • Packaging is currently released only for selected Murata MLCC series in the above sizes; suitability depends on series, detailed specs, and production process.
  • Component unit pricing remains unchanged compared to the same parts in conventional packaging, simplifying cost comparison.

Standardization and interoperability

  • The bulk case format is part of a broader industry effort under the Japan Electronics and Information Technology Industries Association (JEITA) to define standards for ultra‑small SMD bulk packaging.
  • The specification has been published as IEC TS 60286‑6‑1, providing an international technical reference for mechanical dimensions and interface conditions.
  • Murata intends to offer a royalty‑free license for the standardized specifications, encouraging broader ecosystem support among feeder and equipment vendors.

Equipment ecosystem

  • Use of the bulk case requires a bulk‑case‑compatible feeder on the surface‑mount line.
  • The feeder is responsible for singulating and orienting individual MLCCs from the case and delivering them to the pick‑up position with sufficient stability for high‑speed placement.
  • Murata explicitly advises contacting mounting equipment manufacturers for details on feeder availability, interface options, and performance data.

Source

This article is based on information provided in a Murata Manufacturing Co., Ltd. press release describing the introduction of a bulk case packaging format for ultra‑small MLCCs and related standardization activities, supplemented by the manufacturer’s publicly available corporate information and standards references.

References

  1. Murata press release: Bulk case MLCC packaging
  2. Murata corporate website
  3. Murata product and technology portal

Related

Recent Posts

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

11.9.2026
34

LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

10.9.2026
36

Emerging Capacitor Markets in Fusion Energy

10.9.2026
48
Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

10.9.2026
22
onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

9.9.2026
104
TDK CN series 10 µF 100 V X7R soft-termination multilayer ceramic capacitor in 3225 EIA 1210 package

TDK Releases 100 V Soft-Termination X7R MLCCs 10 uF in 3225 Package

9.9.2026
24
Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

7.9.2026
23

Murata Expands Automotive Metal Power Inductor Range

7.9.2026
40

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
56

Upcoming Events

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Ohm’s Law Answers Your Questions

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved