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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

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    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

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    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

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GaN-on-Silicon is Ready for Space

15.3.2017
Reading Time: 2 mins read
A A

source: Microwaves & RF news

Mar 14, 2017 Jack Browne | Microwaves and RF
Gallium-nitride (GaN) transistors are well known for their roles in RF/microwave amplification, but the active devices are also essential building blocks for high-speed power conversion and power supplies.

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Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

Recent testing of GaN-on-silicon (GaN-on-Si) enhancement-mode devices by Imec, in collaboration with Thales Alenia Space Belgium, has revealed that these devices are well suited for space applications, where high doses of radiation can degrade device performance. Testing showed consistent performance before and after irradiation with heavy ions and neutrons, as typically found in space applications such as satellites.

The measurements offer strong evidence of the suitability of the GaN-on-Si devices for space-based power conversion applications. Testing was conducted on Imec’s 200-mm GaN-on-Si process devices, which showed good radiation hardness and no permanent degradation in transistor characteristics following irradiation. Because the GaN devices are fabricated on silicon substrates, they are compatible with CMOS devices fabricated on silicon for simplified integration of power-conversion and computing circuitry. Measurements followed the framework of the European Space Agency (ESA) project ESA AO/1-7688/13/NL/RA, “GaN devices for space-based DC-DC power conversion applications.”

“These results are important to start using this promising technology for space applications,” noted Rudi Cartuyvels, executive vice president at Imec. “Also, it demonstrates that our 200-mm GaN-on-Si platform has reached a high level of technology readiness and can be adopted by industry.

“Thanks to innovations in transistor architecture and substrate technology, we’ve succeeded in making GaN devices on larger wafer diameters than used today, which brings lower cost perspectives for the second generation of GaN-on-Si power devices,” he added. “Imec is also looking beyond today’s technology, exploring novel substrates, higher level of integrations, and novel devices.”

featured image: Automated wafer probes are measuring the electrical performance of DC power devices on GaN substrates. (Courtesy of Imec)

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