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    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

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    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

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    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

    SCHURTER THT DIP Switches Support Hardware-Level Configuration

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GaN-on-Silicon is Ready for Space

15.3.2017
Reading Time: 2 mins read
A A

source: Microwaves & RF news

Mar 14, 2017 Jack Browne | Microwaves and RF
Gallium-nitride (GaN) transistors are well known for their roles in RF/microwave amplification, but the active devices are also essential building blocks for high-speed power conversion and power supplies.

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Recent testing of GaN-on-silicon (GaN-on-Si) enhancement-mode devices by Imec, in collaboration with Thales Alenia Space Belgium, has revealed that these devices are well suited for space applications, where high doses of radiation can degrade device performance. Testing showed consistent performance before and after irradiation with heavy ions and neutrons, as typically found in space applications such as satellites.

The measurements offer strong evidence of the suitability of the GaN-on-Si devices for space-based power conversion applications. Testing was conducted on Imec’s 200-mm GaN-on-Si process devices, which showed good radiation hardness and no permanent degradation in transistor characteristics following irradiation. Because the GaN devices are fabricated on silicon substrates, they are compatible with CMOS devices fabricated on silicon for simplified integration of power-conversion and computing circuitry. Measurements followed the framework of the European Space Agency (ESA) project ESA AO/1-7688/13/NL/RA, “GaN devices for space-based DC-DC power conversion applications.”

“These results are important to start using this promising technology for space applications,” noted Rudi Cartuyvels, executive vice president at Imec. “Also, it demonstrates that our 200-mm GaN-on-Si platform has reached a high level of technology readiness and can be adopted by industry.

“Thanks to innovations in transistor architecture and substrate technology, we’ve succeeded in making GaN devices on larger wafer diameters than used today, which brings lower cost perspectives for the second generation of GaN-on-Si power devices,” he added. “Imec is also looking beyond today’s technology, exploring novel substrates, higher level of integrations, and novel devices.”

featured image: Automated wafer probes are measuring the electrical performance of DC power devices on GaN substrates. (Courtesy of Imec)

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