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    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Murata Opens EMC Test Lab in Nuremberg to Enhance Automotive Support

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Molex Acquires Smiths Interconnect

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    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

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    Coupled Inductors in SEPIC versus Flyback Converters

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Interview with Yageo CTO Philip Lessner Ph.D. on Electronic Components Current and Future Trends

29.10.2024
Reading Time: 1 min read
A A

In this video by Octopart and Edgewater, Philip Lessner, Ph.D, Chief Technology Officer at the Yageo Group discusses the latest trends and insights in the electronic component marketplace.

YAGEO Group is a leading electronic component company with capabilities on a global scale, including production and sales facilities in Asia, Europe and the Americas. Phillip discusses the latest developments in the future of work in the electronic components industry.

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Source: Edgewater

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