Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

IPC Class 2 vs Class 3 Solder Joints Requirements Explained

27.2.2025
Reading Time: 5 mins read
A A

In this post, inspired by the Samtec blog, we’ll briefly examine IPC-A-610 Class 2 and Class 3 J-lead and Gull Wing solder joints, along with their respective requirements.

In the manufacturing world there are standards for just about everything, and they all are typically there to ensure a product can perform as expected for the end application. Among these standards is IPC-A-610 covering solder joints for varying types of connector termination styles.

RelatedPosts

Samtec Links Automotive Connector Demands to Software-Defined Cars

Samtec 100-CM 1.0 mm RF Connectors Extend to 120 GHz

EMC‑Compliant PCB and Connector Design Guidelines

What is IPC-A-610

IPC-A-610 delves into the concept of “Acceptability of Electronic Assemblies,” and for the purpose of this blog, we will specifically focus on the requirements for J-Lead and Gull Wing solder connections. Considering the diverse applications that necessitate varying requirements, IPC has established different classes, each specifying the aesthetic characteristics of solder joints that must conform to those class specifications.

Class 2 

J-Lead Components

IPC-A-610 Class 2 is the standard requirement for J-lead component termination soldering. Class 2 products need extended reliability, but it’s not a critical requirement. We’ll cover some of the requirements below, but not all of them.

Class 2 allows the manufacturer more room for imperfections in the assembly, such as a larger toe offset (1) and side overhang (2), and a thinner end joint width (3) as shown in Figures 1 and 2 below. For side overhang, Class 2 states that the component lead may overhang the side of the pad (2), a maximum of 50% the width of the lead.

The end joint width (3) is the width of the solder joint at the most narrow point and must be a minimum of 50% of the lead width (4).

Figure 1. solder joint toe offset
Figure 2. solder joint side overhang, joint width and lead width

The solder thickness (5) between the lead and the pad landing is not specified, but a properly wetted fillet must be present. The side joint length (6) of the solder joint, at the narrowest point, must be at least 150% the width of the lead (4).

Figure 3. solder joint thickness
Figure 4. solder joint length

Class 2 is typically focused on a commercial type of product where continued performance and extended life is required, and an uninterrupted service of the product is desired but not mission critical. The normal environment (temperature and contamination) for this end user is not considered extreme.

Gull Wing Components

Because Class 2 provides the manufacturer a larger degree of imperfection in the solder joint, it is easier to manufacture at this level and often cheaper to produce. An example of this is the “pad offset” or the overhang of the contact from the pad. The Toe Overhang is defined in similar way as shown in Figure 1 for J-lead also for Gull Wing termination style, and is acceptable as long as it does not violate electrical clearance. This also means there is no requirement for a Toe Filet. The Side Overhang is shown in Figure 2., and Joint Width is also measured as is shown in (3) on the same figure.

Side Overhang (2), for Class 2, states a component lead may overhang the side of the land (contact pad) with a maximum of 50% the lead width(4), or 0.02 in. (0.5 mm), whichever is less. End Joint Width (3) is the width of the solder joint at the most narrow point. This width must be a minimum of 50% the width of the lead (4) . 

Side Joint Length (6) for a “long foot,” or a Lead Foot Length (5) that is equal to or greater than three lead widths (4), the Side Joint Length (6) must be a minimum of 3 (4) or 75% of (5); which ever is the longer of the two.

Class 3

J-Lead Components

Many high-reliability components and connectors can meet IPC-A-610 Class 3, which is usually required when a product must maintain high performance in extreme or harsh conditions. Military, aerospace, and medical applications typically require Class 3 products.

Class 3 imposes stricter inspection requirements for solder joints compared to Class 2. While the solder thickness (5) remains unchanged, the side joint length (6) is the same as Class 2. However, several other specifications have increased requirements.

For instance, the side overhang (2) and end joint width (3) are both tightened by 25% in both directions. The side overhang is limited to a maximum of 25% of the lead width (4), while the end joint thickness (3) is increased to a minimum of 75% of the lead width (4). Although this may not appear to be a significant increase, it does pose challenges in producing conforming products.

Gull Wing Components

Some requirements are similar in Class 2 and Class 3; such as the Solder Joint Length (6) and Toe Overhang (1). However, many of requirements are significantly more difficult to meet in a Class 3 solder joint.

End Joint Width (3) and Side Overhang (2), are both required to meet a more stringent specification. The End Joint (3) must be at least 75% of the lead width (4), and the Side Overhang (2) only affords the lead width (4) a maximum 25% of the lead width (4) or 0.02 in. (0.5 mm), whichever is less of overhang on the side of land.

Related

Source: Samtec

Recent Posts

Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
1
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
1
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
6
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
21
YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

YAGEO Unveils Multilayer Piezoelectric Actuators

5.10.2026
15
YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

1.10.2026
38
Isabellenhütte HFF flexible Kapton heater with etched MANGANIN foil structure and wire lead exit

Isabellenhütte Introduces Flexible Heaters for Space Thermal Control

1.10.2026
27
TLVR multiphase coupled inductors, auxiliary ballast inductor

TLVR Coupled Inductors: Fast Load-Step Response and Current-Dependent Ballast-Inductor Optimisation

24.9.2026
65
Littelfuse AK-FL FlatSuppressX axial-leaded bidirectional TVS diodes for high-voltage aviation DC power protection

Littelfuse AK-FL TVS Diodes for Aviation DC Power Rails

24.9.2026
20

Upcoming Events

Oct 9
18:00 - 19:00 CEST

Edgewater Research 3Q26 Electronic Components Review Outlook Webinar

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved