Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    VINATech Targets AI Data Center Supercapacitor Boom

    Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

    TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

    Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

    Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

    Würth Elektronik Present in IEEE APEC

    Samsung Three Pillars MLCC Strategy for AI Hardware Topology

    Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

    KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    VINATech Targets AI Data Center Supercapacitor Boom

    Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

    TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

    Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

    Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

    Würth Elektronik Present in IEEE APEC

    Samsung Three Pillars MLCC Strategy for AI Hardware Topology

    Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

    KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

KEMET Introduces Commercial KPS MLCCs with Tin/Lead Termination for Defense and Avionic Applications

2.3.2017
Reading Time: 1 min read
A A

source: Kemet news

Greenville, S.C. (February 28, 2016) – KEMET Corporation (NYSE: KEM), a leading global supplier of electronic components, today announced the expansion of its KEMET Power Solutions (KPS) Multilayer Ceramic Capacitor (MLCC) product line to include a tin/lead termination option. Available in EIA 1210 and 2220 cases sizes, KPS “L” termination commercial capacitors allow designers to meet the needs of defense, avionic and industrial applications requiring a more robust termination system that helps mitigate tin whisker growth.
KPS utilizes a proprietary lead-frame technology to vertically stack one or two MLCCs in a parallel circuit configuration in a single compact surface mount package. The attached lead-frame mechanically isolates the capacitors from the printed circuit board, offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two-chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices.

RelatedPosts

VINATech Targets AI Data Center Supercapacitor Boom

Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

Typical applications include smoothing circuits, DC/DC converters, power supplies, and noise reduction circuits with a direct battery or power source connection. KPS “L” capacitors are also ideal for any application that is subject to high levels of board flexure or temperature cycling.

Related

Recent Posts

VINATech Targets AI Data Center Supercapacitor Boom

26.2.2026
18

Littelfuse NANO2 415 SMD Fuse Wins 2025 Product of the Year

26.2.2026
9

TDK Introduces 350V Safety Film Capacitors for Compact EMI Suppression

26.2.2026
11

Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

24.2.2026
22

Würth Elektronik Present in IEEE APEC

24.2.2026
16

Samsung Three Pillars MLCC Strategy for AI Hardware Topology

24.2.2026
48

Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

24.2.2026
15

KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

24.2.2026
23

Bourns Unveils High Volt GDT for High‑Energy Surge Protection

23.2.2026
6

Upcoming Events

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version