Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns BTJ Thermal Jumper Chips for PCB Heat Management

    One‑Pulse Characterization of Nonlinear Power Inductors

    Wk 51 Electronics Supply Chain Digest

    Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

    Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

    Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

    Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

    Littelfuse Introduces Automotive Current Sensors for EV Battery, Motor, and Safety Systems

    Vishay Releases Fast Acting Thin Film Chip Fuses

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns BTJ Thermal Jumper Chips for PCB Heat Management

    One‑Pulse Characterization of Nonlinear Power Inductors

    Wk 51 Electronics Supply Chain Digest

    Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

    Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

    Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

    Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

    Littelfuse Introduces Automotive Current Sensors for EV Battery, Motor, and Safety Systems

    Vishay Releases Fast Acting Thin Film Chip Fuses

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

March 24 Component Distribution Supply Chain

26.3.2024
Reading Time: 3 mins read
A A

March 2024 component distribution insights by Edgewater Research shows modest directional improvements in sales, distributors broadly seen implementing costs savings initiatives.

Key Takeaways:

RelatedPosts

Wk 51 Electronics Supply Chain Digest

Wk 50 Electronics Supply Chain Digest

Wk 49 Electronics Supply Chain Digest

  1. Semi POS viewed as remaining soft, showing limited signs of improvement post CNY with B2B remaining at 0.8-0.9x. IP&E demand better with clear signs of pick up in turn orders and B2B broadly around parity.
  2. Inventory seen directionally improving in 1Q on most suppliers relaxing NCNRs. Semi inventory still viewed as challenging, with digestion potentially stretching into 2H. STM inventory consistently noted as worst in shape, well above targets and averages.
  3. Analog Devices seen restructuring staff tied to Arrow and targeting $800M to $1B in sales shift direct over the next 12 months.
  4. Arrow seen laying off ~2K employees in 1Q across layers and geos, with focus on staff supporting TXN/ADI product lines.
  5. Avnet is seen laying off ~250 Farnell employees globally in 1Q and shifting a substantial portion of US customer support to the UK.
  6. Arrow’s 4Q inventory drawdown seen driven by aggressive NCNRs, leading alienated customers to pivot future demand away.
  7. Avnet is seen as continuing to outperform Arrow gaining share sequential in Americas and EMEA. In IP&E, Avnet also seen outperforming over the last 6 months, gaining share with key lines from TE, Amphenol, Yageo, AVX, others.
  8. TTI seen as outperforming broadline competitors, product mix (IP&E vs. semi), end market exposure and consistency in market viewed as driving outperformance.
  9. High service distribution remains challenging, albeit customer counts viewed as showing improvements.

Top 3 Channel Comments:

  • Demand in China is challenging, we are starting to have doubts if we will see a recovery this year. The year looks very similar to last when we were expecting a 2H recovery at this time but it never came, except in pockets like Auto.
  • We saw clear signs of Arrow pushing product at the end of 4Q, mostly via NCNRs to customers. By doing that Arrow pissed off a lot of customers. The trend is not new but the actions in 4Q reached a tipping point. This opens the door for Avnet. Arrow could have permanently shut the door for Avnet after the SAP debacle in 2016-2017 but now they are giving customers a reason to return to Avnet.
  • A year ago, Arrow was outperforming Avnet in IP&E, today the dynamic has flipped. Avnet has executed better, gaining share with key lines like TE, Amphenol and some of the large passive suppliers like Yageo, and AVX.

Conclusion:
Distribution fundamentals remain challenging as the industry continues to grapple with elevated inventory levels, most notably in semiconductors.

While semis remain problematic, we continue to see signs of progress on IP&E inventory which we believe is leading to outperformance of distributors more leveraged IP&E vs. semis. With inventories elevated and sales muted, we are seeing an increased focus on cost reductions across distributors.

Full report available from: Dennis Reed, Sr. Research Analyst, Edgewater Research

Related

Source: Edgewater Research

Recent Posts

Littelfuse Completes Acquisition of Basler Electric

12.12.2025
32

YAGEO Achieved a Record Revenue in November on Strong AI Demand

10.12.2025
50

Key Interconnect Technologies for 2025

5.12.2025
36

Bishop Reveals Top 10 Connector Manufacturers

5.12.2025
104

November 2025 Interconnect, Passives and Electromechanical Components Market Insights

4.12.2025
108

DigiKey Launches 2025 DigiWish Holiday Giveaway for Global Engineering Community

3.12.2025
26

Skeleton Opens €220M Supercapacitor Leipzig Factory

3.12.2025
27

TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

27.11.2025
75

Passive Components for Next Gen Automotive Systems

26.11.2025
179

Upcoming Events

Jan 27
16:00 - 17:00 CET

Simplifying Vehicle Development with Automotive Ethernet and Zonal Smart Switch Technologies

Feb 24
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version