Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 18 Electronics Supply Chain Digest

4.5.2026
Reading Time: 4 mins read
A A

Electronics Supply Chain Weekly Digest 5-1-26.

DATAPOINT OF THE WEEK: S&P reported US mfg PMI surged to 54.5 in Apr, up from 52.3 in Mar, marking the strongest expansion since May-22 and the eighth straight month of being in expansion territory. The M/M increase was driven by a steep rise in new order growth and stronger uplift in output.

RelatedPosts

Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

However, some of the growth appears to be driven by stock rebuilding efforts to protect against increasing price and supply pressures related to the Middle East. ISM reported Apr US mfg PMI of 52.7, unchanged from March.

RatingDog China mfg PMI rose to 52.2 in Apr, from 50.8 in Mar, marking the strongest improvement since Dec-20, supported by faster rise in new order growth, aided by continued export momentum. In turn, production also improved M/M. China’s Government mfg PMI diverged from RatingDog with Apr PMI moderating to 50.3, from 50.4 in Mar.

Headlines:

Auto/Transportation

  • BYD’s 1Q net profit plunges 55.4% Y/Y to $599M as domestic EV sales slump for a seventh straight month.
  • China suspends new robotaxi permits after ~200 Baidu Apollo Go vehicles halted mid-traffic in Wuhan, according to Nikkei Asia
  • GM core profit rose 22% Y/Y to $4.3B, raises 2026 outlook by $500M on truck strength and tariff refund.
  • Magna beats 1Q sales expectations but trims full-year guidance amid tariff headwinds and EV uncertainty
  • Hongqi in talks to build vehicles at Stellantis’s Zaragoza plant in its first western Europe manufacturing push, Reuters reported
  • Tesla announces its first Semi rolls off high-volume production line, with 500-mile range and deliveries expected this year
  • President Trump threatens to raise EU auto tariffs to 25% next week from 15%, citing non-compliance with August trade deal
  • VW profit drops 14% Y/Y on tariffs and EV writedown and is weighing building China models in Europe

Datacenter

  • AWS revenue jumps 28% Y/Y to $37.6B in 1Q, ahead of expectations as enterprise AI demand accelerates.
  • Google Cloud’s 1Q revenue surges 63% Y/Y with AI tools for large businesses being primary growth driver
  • Google, Amazon, Microsoft, and Meta project combined $700B in datacenter capex for the full year

Industrial

  • Meta announces deal with Overview Energy for up to 1GW of space-based solar power to fuel AI datacenters

Semiconductors

  • ASE Technology raises 2026 advanced packaging revenue target to over $3.5B on surging AI chip demand.
  • Delta Electronics posts 34% Y/Y revenue growth in 1Q26, driven by strong demand for AI server power and datacenter infrastructure
  • Denso abandons Rohm acquisition bid after failing to secure board support, pivots to broader chip partnerships.
  • DeepSeek V4’s model optimization for Huawei’s Ascend 950 chips sparks scramble among ByteDance, Tencent, and Alibaba for new orders, according to Reuters
  • MediaTek doubles its 2026 AI ASIC revenue target to $2B, eyeing 10–15% share of a $70–80B market, per Liberty Times / TechNews
  • Nexperia China says production and orders unaffected after parent Wingtech Technology triggers risk warning
  • Nvidia B300 servers hit $1M in China, nearly double US prices, as export curbs and smuggling crackdown choke supply, according to Reuters
  • NXP reports strong 1Q with all end markets up Y/Y; 2Q guide ahead of expectations as datacenter business scales to >$500M in 2026
  • onsemi deepens SiC partnership with Geely to power next-gen 900V EV platforms.
  • Power semiconductor lead times stretch to 30 weeks on strong AI demand, says SemiMedia
  • Qualcomm announces plans to begin shipping datacenter chips by year-end across CPUs, inference accelerators, and ASICs
  • Samsung chip division profit surges 49-fold to $36.4B in 1Q, and expects memory supply shortage to worsen in 2027
  • Sandisk’s 3Q revenue more than triples to $5.95B as AI demand drives $42B in long-term supply contracts

Consumer

  • Apple posts strongest quarterly sales growth in four years, guides C2Q at 14%-17% above expectations

Related

Source: Edgewater Research

Recent Posts

Wk 34 Electronics Supply Chain Digest

7.9.2026
6

Wk 33 Electronics Supply Chain Digest

31.8.2026
53

Wk 32 Electronics Supply Chain Digest

24.8.2026
66

Wk 31 Electronics Supply Chain Digest

17.8.2026
73

Wk 30 Electronics Supply Chain Digest

3.8.2026
69

Wk 29 Electronics Supply Chain Digest

27.7.2026
57

Wk 28 Electronics Supply Chain Digest

20.7.2026
108

Wk 27 Electronics Supply Chain Digest

13.7.2026
83

Wk 26 Electronics Supply Chain Digest

6.7.2026
80

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved