Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Source: Semiconductor Intelligence

    October 25 Electronics Production: U.S. vs. Global Changes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

    Source: Semiconductor Intelligence

    October 25 Electronics Production: U.S. vs. Global Changes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Measuring, Modeling, Simulating Capacitors and Inductors

22.10.2025
Reading Time: 8 mins read
A A

Power supply switching ripple and control loop phase margin are dominated by the output inductor and the bulk capacitors.

Simple RLC capacitor and inductor models can result in a design with more capacitors than necessary adding to the design cost, consuming valuable circuit board real estate and degrading the control loop performance.

RelatedPosts

Power Inductors Future: Minimal Losses and Compact Designs

Degradation of Capacitors and its Failure Mechanisms

Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

Key Takeaways

  • Accurate modeling of capacitors and inductors is crucial for power integrity in electronic systems.
  • The 2-port shunt-through measurement technique offers over 100 dB dynamic range, providing precise impedance data for reliable modeling.
  • Engineers can reduce unnecessary components and PCB space by utilizing optimized broadband SPICE models.
  • Calibrating the measurement system minimizes errors and improves simulation accuracy, especially at high frequencies.
  • Advanced modeling techniques enhance control loop stability and overall design efficiency.

Most capacitor datasheets provide very limited information, such as maximum ESR at 100kHz and not the desired information regarding typical values and frequency dependancies of the C, ESR, and ESL.

This presentation will show how to make these measurements efficiently and how to use the results directly or create high fidelity measurement based models for simulation in ADS.

Introduction

Accurate modeling of capacitors and inductors is essential for achieving robust power integrity in modern electronic systems. Traditional RLC models often oversimplify component behavior, leading to overdesign, excessive capacitor counts, and degraded control loop performance. By leveraging advanced measurement techniques—particularly the 2-port shunt-through method—engineers can extract high-fidelity data suitable for both SPICE and EM simulations. This presentation outlines the methodology, measurement process, and optimization strategies for creating broadband models that balance accuracy, cost, and PCB efficiency.

Measurement Fundamentals

The cornerstone of accurate modeling is precise impedance measurement. The 2-port shunt-through method is preferred over 1-port reflection due to its superior dynamic range and ability to measure impedances below 1 mΩ. A coaxial transformer is required for low-frequency, low-impedance measurements to maintain fidelity.

MethodDynamic RangeLowest Measurable ImpedanceUse Case
1-Port Reflection~66 dB~200 mΩGeneral RF components
2-Port Shunt-Through>100 dB< 1 mΩPower inductors, bulk capacitors

Calibration and Setup

Calibration is critical for eliminating systematic errors. For frequencies below 50 MHz, a THRU calibration between ports is sufficient. At higher frequencies, a full SOLT (Short, Open, Load, Thru) calibration is required. Components are mounted either in a fixture or directly on a PCB, with careful attention to minimizing lead length and parasitic effects.

Modeling Capacitors

Ceramic capacitors can be modeled accurately using two parallel RLC branches. Anchor points are extracted from measurements: low-frequency capacitance, high-frequency inductance, series resonant frequency, and ESR. Bulk capacitors, especially non-polymer types, exhibit frequency-dependent resistance and capacitance, requiring more sophisticated models. Optimizers are employed to minimize the error between measured and simulated impedance.

Modeling Inductors and Ferrite Beads

Inductors and ferrite beads often exceed the 225 Ω measurement limit at high frequencies. To extend the measurable range, series resistors are added at the VNA ports, effectively scaling the measurement window. This allows accurate characterization from milliohms up to several kilo-ohms. Parasitics introduced by the series resistors are minimized by integrating them directly onto the DUT mounting board.

Series Resistor ValueMinimum Measurable ImpedanceMaximum Measurable Impedance
0 Ω (baseline)1 mΩ225 Ω
100 Ω0.5 mΩ600 Ω
499 Ω11 mΩ2.5 kΩ

Optimizer Workflow

The optimizer process begins with manual tuning of six shaping parameters to achieve a reasonable fit. Once initialized, the optimizer iteratively minimizes the error function defined as the difference between measured and simulated impedance. The result is a broadband SPICE model that overlays nearly perfectly with the measured data, ensuring simulation accuracy for both time-domain and frequency-domain analyses.

Conclusion

Accurate capacitor and inductor models are essential for power integrity design. By employing the 2-port shunt-through measurement method, separating mount parasitics, and leveraging optimizers, engineers can reduce component count, save PCB space, and improve control loop stability. These techniques enable the creation of high-fidelity SPICE and EM models that closely match real-world behavior, ensuring cost-effective and reliable designs.

Frequently Asked Questions: Measuring, Modeling, and Simulating Capacitors and Inductors

Why is accurate modeling of capacitors and inductors important?

Accurate models ensure robust power integrity, reduce unnecessary component counts, save PCB space, and improve control loop stability. Oversimplified RLC models often lead to overdesign and degraded performance.

What measurement method is recommended for high-fidelity modeling?

The 2-port shunt-through VNA method is preferred, offering over 100 dB dynamic range and sub-milliohm resolution, making it ideal for bulk capacitors and power inductors.

How do mount parasitics affect simulation accuracy?

Mount parasitics must be separated from intrinsic component behavior. Without this step, EM simulations can misrepresent real-world performance, leading to design inefficiencies.

What role do optimizers play in model creation?

Optimizers refine broadband SPICE models by minimizing the error between measured and simulated impedance, ensuring near-perfect alignment with real-world data.

What are the benefits of advanced modeling techniques?

They reduce component count, lower costs, save PCB real estate, and improve control loop phase margin, resulting in more efficient and reliable designs.

How to Measure and Model Capacitors and Inductors

  1. Prepare Measurement Setup

    Use a Vector Network Analyzer (VNA) with the 2-port shunt-through method. For low-frequency, low-impedance measurements, include a coaxial transformer.

  2. Calibrate the System

    Perform THRU calibration for frequencies below 50 MHz. For higher frequencies, use a full SOLT (Short, Open, Load, Thru) calibration to eliminate systematic errors.

  3. Mount Components Carefully

    Place components in a fixture or directly on a PCB, minimizing lead length and parasitic effects to ensure accurate data capture.

  4. Extract Key Parameters

    Identify low-frequency capacitance, high-frequency inductance, ESR, and series resonant frequency. For bulk capacitors, account for frequency-dependent resistance and capacitance.

  5. Apply Optimizer Workflow

    Manually tune shaping parameters, then use an optimizer to minimize error between measured and simulated impedance, creating a broadband SPICE model.

  6. Validate and Simulate

    Overlay the SPICE model with measured data to confirm accuracy. Use the model in both time-domain and frequency-domain simulations for reliable design validation.

Related

Source: Picotest

Recent Posts

Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

30.10.2025
2

Capacitor Self-balancing in a Flying-Capacitor Buck Converter

30.10.2025
1

Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

30.10.2025
3

Vishay Releases Space-Grade 150 W 28V Planar Transformers

29.10.2025
7

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
23

Samsung Releases Automotive Molded 2220 1kV C0G MLCC

23.10.2025
42

How to Select Ferrite Bead for Filtering in Buck Boost Converter

23.10.2025
40

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
38

Power Inductors Future: Minimal Losses and Compact Designs

30.10.2025
45

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

22.10.2025
9

Upcoming Events

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

Nov 6
14:30 - 16:00 CET

Self-healing polymer materials for the next generation of high-temperature power capacitors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version