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    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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Q2 21 German Components Distribution Achieves Double-Digit Growth with Significant Surge in Demand

8.11.2022
Reading Time: 2 mins read
A A

Deutsche Bauelemente-Distribution (according to FBDi e.V.) posted a sales increase of 17.5% and an increase of 132% in order intake in the second quarter of 2021. The shortage of components prevents a better result.

The first consequences of the component shortage became visible in the second quarter of the year. The distributors registered in the FBDi association recorded a 17.5% increase in sales to 802 million Euros from April to June 2021. In the same period, bookings virtually exploded, reaching two new records with 132% growth and a total volume of 1.43 billion Euros. As in Q1, the lack of availability slowed down sales growth
considerably. The book-to-bill rate rose again, to an incredible 1.79.

At product level, Passive Components grew significantly by 35% to 104 million Euros, as did Electromechanics by 31% to 112 million Euros. Semiconductors, the strongest product group, “only” grew by 11.2% to 520 million Euros, but had a massive increase in bookings to
over 1 billion Euros. Electromechanical sensors grew by 54%, displays by 3.9%, power supplies by 28.2% and assemblies and devices by 43.3%. The distribution of sales shows slight shifts: Semiconductors take 65% of sales, passives 13%, electromechanics 14%, power supplies 4%, and the remaining 4% are distributed among the other products.

FBDi Chairman of the Board Georg Steinberger: “In view of the absurdly high order situation, it can be assumed that the increase in sales was characterized more by a lack of availability and price increases than by real growth, which will hopefully materialize in the coming quarters. How much of the almost 1.5 billion euros in new orders is real will become clear next year at the latest, because a large proportion of these are long-term advance bookings by many customers who want to avoid a situation like now.”

Interestingly, the discussion about billions in subsidies for 5-nm chip factories has calmed down again somewhat, according to Steinberger: “We assume that work is continuing in secret on the politicians to distribute billions in tax gifts, but the differentiation of the discussion has already begun. After all, the European problem cannot be measured in nanometers, but in the lack of interesting chip designs suitable for mass production in the style of smartphone or tablet processors. And this is due to the fact that, compared to the USA, China and Japan, there are hardly any significant research and educational structures for microelectronics in this country, and just as little investment and support landscape for
chip start-ups. As long as subsidies always trickle down to large companies to finance things they do anyway, this will not change.”

RelatedPosts

German Component Distribution Market Rebounds in Q1 2026 According to FBDi

FBDi Pesimistic about 2024 German Components Distribution Market 

FBDi German Components Distribution Market Q3/2023 Slow Down but Hopes for Consolidation

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Source: FBDi

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