Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Unveils Metal Powder Core High Current Low DCR Shielded Power Inductor

    Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

    Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

    Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

    Samtec Releases 800-Position High-Performance Array Connectors  

    DigiKey Announces Back to School Giveaway to Empower Tomorrow’s Innovators

    Ripple Steering in Coupled Inductors: SEPIC Case

    TDK Releases Low Loss Thin-Film Inductors for AI Data Centers

    Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Percolation Phenomenon and Reliability of Molded Power Inductors in DC/DC converters

    Root Causes and Effects of DC Bias and AC in Ceramic Capacitors

    How to Calculate the Output Capacitor for a Switching Power Supply

    Switched Capacitor Converter Explained

    Understanding Inductor Dot Markings and Their Application in LTspice

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Risk of Tantalum Capacitor Anode Overheating: Modeling and Practical Solutions

18.2.2025
Reading Time: 9 mins read
A A

This article by Dr. V. Azbel, an Independent consultant on tantalum capacitors, introduces software-based approach on assessing the risk of tantalum capacitor anode overheating by modeling and practical solutions example.

Introduction

The development of a tantalum capacitor (TC) anode requires precise control over sintering and forming processes. One of the key challenges is anode overheating during the formation stage, which is associated with the growth of the amorphous tantalum pentoxide (Ta₂O₅) layer and its impact on the thermal conductivity of the anode neck. Traditional methods for calculating anode parameters require significant time and do not allow for an accurate assessment of overheating risks.

RelatedPosts

Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

Enhanced Process Control in Tantalum Capacitor Anode Manufacturing Reduces Cost and Improves Reliability

Enhancing Effectiveness of Tantalum Capacitor Anode Control

This study proposes a software-based approach to optimizing anode parameters. The developed model quantitatively evaluates the influence of structural characteristics and technological parameters on the anode’s thermal balance. The primary assessment criterion is the Q/Wa coefficient, where Q represents heat dissipation and Wa denotes the energy released. To minimize the risk of overheating, the Q/Wa value must exceed 10.

Modeling Methodology

The modeling of anode thermal balance is based on a geometric representation of its structure. The key stages of the methodology include:

  1. Modeling the Porous Structure of the Anode
    • The anode represents a set of spherical particles forming pores and necks (see Fig. 1a, b).
    • The geometry of the neck critically affects thermal conductivity and electric current distribution.
Fig. 1a,b
  1. Oxide Layer Formation Process
    • During the formation stage, the amorphous Ta₂O₅ Sooner grows inward and outward from the neck surface (see Fig. 2a, b).
    • The growth of the oxide layer (d) reduces the cross-sectional area of the neck (S = π⋅(Rn)²/4) (see Fig. 3), increasing resistance and the released energy Wa.
    • If the oxide layer reaches a critical thickness, the neck becomes completely blocked, leading to anode failure.
Fig 2a,b
Fig.3
  1. Evaluation of Heat Transfer in the Neck Region
    • The primary mechanisms (see Appendix) include the thermal conductivity of tantalum and the amorphous Ta₂O₅ layer.
    • When the oxide’s thermal conductivity is low, heat accumulates, increasing the likelihood of local overheating.
  2. Determining the Q/Wa Coefficient
    • This coefficient is calculated based on the thermal conductivity, resistance, and neck geometry.
    • Experimental data* confirm that for stable anode operation, Q/Wa > 10.
  3. *Tested using tantalum capacitor anodes that have passed reliability testing.

Influence of Anode Parameters on Overheating Risk

Factors affecting heat distribution and the likelihood of overheating include:

  • Neck size and anode porosity: A smaller neck cross-sectional area increases the surface area (see Fig. 4). However, this also increases electrical resistance and the risk of localized heating.
  • Anode Thickness and Shape: Complex geometry complicates heat dissipation, creating localized overheating zones.
  • Transition Layer Between Ta and Ta₂O₅: Reduces thermal conductivity and increases resistance.
Fig.4 Surface Area and Inter-particles Sinter Neck Size as a function of Sinter Temperature

Advantages of the Software-Based Approach

The developed software allows for:

  • Automatic optimization of anode parameters.
  • Prediction of overheating risk based on Q/Wa.
  • Reduction in the number of experiments and time required for developing new TC designs.
  • Elimination of subjective errors in design.

Conclusions

Modeling the anode’s thermal balance, considering neck structure and the oxide layer formation mechanism significantly improves the accuracy of overheating risk predictions. The developed software (with a calculation algorithm flowchart presented in Table 1, see Appendix) provides a convenient tool for the automated selection of optimal anode parameters, enhancing reliability and reducing failure probability. Future model improvements may include accounting for the mechanical properties of the anode for a more detailed analysis.

Integration of the Software into the Anode Production Process

The developed software is designed to calculate the hypothetical risk of overheating, serving as a key tool for optimizing anode parameters. Based on this foundation, an advanced version has been created, enabling real-time detection of issues within the ongoing production process. 

The new software version incorporates real-time integration of experimental data, further increasing the accuracy of overheating risk predictions. This functionality allows for continuous monitoring and adaptive adjustments, ensuring stable process parameters and minimizing failure risks.

Appendix

The table below clearly illustrates the dependence of BET, capacitance, and forming voltage on the size of primary powder particles.

BET determines the range of powder applications—from high-voltage to low-voltage capacitors.
The primary influencing factor is the size of the primary particles while modifying the pressing density and sintering temperature further adjusts the properties.
Sintering regulates porosity (capacitance) and the neck size between grains (forming voltage), allowing the material to be tailored to the required parameters.

This information was used to develop the program flowchart below, which enables the selection of optimal powder parameters based on specified capacitance and operating voltage requirements.

Table 1 Calculation algorithm flowchart 

Experimental data (CABOT, H.C. Starck) used in program development. Size prime particles powder- CABOT

Examples of the program’s operation

Table 2 presents data on the influence of the anode mass within a single design on the risk ofoverheating.

Table 3 shows the influence of different electrolysis parameters applied to a single-sintered pellet design on the risk of anode overheating.

Heat Transfer and Energy Dissipation Mechanisms in the Neck Region, used in Software

The main mechanisms include:

  1. Heat Transfer Through the Cross-Sectional Area of the Neck (q):

q = k⋅S⋅ΔT/h, where k is the thermal conductivity of tantalum (0.4 W·m⁻¹·K⁻¹), ΔT is the temperature difference, which can reach 450°C at the onset of amorphous film crystallization.

  1. Heat Transfer Through the Surface of the Amorphous Film (Q):

Q = k1⋅A⋅ΔT/d, where k₁ is the thermal conductivity of the amorphous film (0.7 W·m⁻¹·K⁻¹), A is the surface area of the film, and d is its thickness.

  1. Energy Dissipation in the Neck
    The reduction of the neck’s cross-sectional area due to increasing forming voltage raises electrical resistance, leading to an increase in dissipated energy (Wa). According to the proposed model, this energy is calculated as:

Wa = Ir²⋅ρ⋅h/S, where Ir is the forming current, ρ is the resistivity, h is the neck length, and S is the cross-sectional area:

S = π⋅L²/4, where L=Rn ​(see Fig. 3).

  1. Risk of Complete Neck Blockage
    If the forming voltage exceeds the optimal level, the radius of the oxide layer (r₁) becomes equal to the radius of the tantalum core (Rn). This results in complete neck blockage, a reduction in capacitance, and an increased risk of failure.

Related

Source: Vladimir Azbel

Recent Posts

Influence of Tantalum Capacitor Pellets Size on Stability During Oxide Film Formation

29.8.2025
10

Modelithics Release Discrete Components Optimization Article for RF/Microwave Designers

28.8.2025
9

Samsung Extends Capacitance of MLCC 0805 X7T 250V to 100nF

28.8.2025
11

Ripple Steering in Coupled Inductors: SEPIC Case

27.8.2025
12

Samsung Releases Ultra–High-Capacitance 4.7uF 2.5V MLCC in 0201 for AI GPU

27.8.2025
25

SEPIC Converter with Coupled and Uncoupled Inductors

26.8.2025
20

Coupled Inductors in SEPIC versus Flyback Converters

26.8.2025
14

Non-Linear MLCC Class II Capacitor Measurements Challenges

19.8.2025
45

Researchers Demonstrated HfO Anti-Ferroelectric Flexible Capacitors

19.8.2025
19

Common Mistakes in Flyback Transformer Specs

15.8.2025
63

Upcoming Events

Sep 3
15:30 - 17:30 CEST

How to Choose Your Magnetic Supplier

Sep 16
17:00 - 18:00 CEST

EMI Shielding Challenges

Sep 22
September 22 @ 13:00 - September 25 @ 15:15 EDT

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Sep 30
September 30 @ 12:00 - October 2 @ 14:00 EDT

MIL-Std-883 TM 2010

Oct 17
12:00 - 14:00 EDT

External Visual Inspection per MIL-STD-883 TM 2009

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Core Materials, Permeability and Their Losses

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version