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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

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    Researchers developed a polymer capacitor by combining two cheap, commercially available plastics. The new polymer capacitor makes use of the transparent material — pictured here, with vintage Penn State athletic marks visible through it — to store four times the energy and withstand significantly more heat.  Credit: Penn State

    Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C

    ECIA January 2026 Reports Strong Sales Confidence

    Vishay Unveils Ultra-Compact 0201 Thick Film Chip Resistors

    Würth Elektronik Component Data Live in Accuris

    Coilcraft Releases Automotive Common Mode Chokes

    MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    YAGEO Extends Antenna Portfolio with Wi‑Fi 6E/7 and Tri‑band GNSS Solutions

    SCHURTER Introduces 2410 SMD Fuse for Robust AC/DC Protection

    TDK Releases High Temp 175C Automotive NTC thermistors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
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    • New Products
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    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

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    Choosing the Right Capacitor: The Importance of Accurate Measurements

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Samsung Delivers Silicon Capacitors to Marwell AI Systems

24.6.2025
Reading Time: 2 mins read
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Samsung Electro-Mechanics expands into AI chip market with silicon capacitors supply to Marvell Technology.

Samsung Electro-Mechanics has commenced production and supply of silicon capacitors to Marvell Technology, a leading U.S.-based semiconductor company specializing in artificial intelligence (AI) chip solutions.

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Production began in the first quarter of 2025, with the first batch of silicon capacitors now successfully delivered to Marvell, positioning Samsung as a significant contender in the competitive AI chip market, traditionally dominated by Nvidia.

Silicon capacitors, integral components in modern electronics, ensure stable power delivery and efficient signal transmission within computer chips. Constructed using advanced silicon wafer technology, these capacitors can be positioned in close proximity to the main chip, enhancing system speed and reliability—critical attributes for AI chips tasked with processing vast amounts of data swiftly and accurately.

During CES 2025, Jang Deok-hyeon, CEO of Samsung Electro-Mechanics, proudly announced that the company has secured contracts with two major clients for its silicon capacitors. Mr. Jang further outlined the company’s ambitious target to achieve over 100 billion won (approximately USD 75 million) in sales within the next one to two years.

This milestone is a key component of Samsung Electro-Mechanics’ broader technological advancement initiative. Following the introduction of the ‘Mi-RAE’ project at CES 2024, the company has been pioneering innovations across five strategic areas: silicon capacitors, all-solid-state batteries, hybrid lenses, glass substrates, and solid oxide electrolysis cells.

In addition to silicon capacitors, Samsung is set to ramp up production of glass substrates and distribute battery samples to clients within the year. The company has already commenced mass production of hybrid lenses, marking significant progress in its diversification efforts.

Through its strategic partnership with Marvell Technology, Samsung Electro-Mechanics is making significant inroads into the U.S. AI chip market. As the demand for AI-driven smart devices and high-performance computing solutions continues to escalate, this collaboration is poised to play a pivotal role in shaping the future of AI technology, both in the U.S. and globally.

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