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    Samsung Electro-Mechanics Releases High-Capacitance MLCCs for AI Server Applications

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    Samsung Electro-Mechanics Releases High-Capacitance MLCCs for AI Server Applications

    Samsung Electro-Mechanics Releases 165C Automotive 0806 Size Power Inductors

    Coupled Inductors Circuit Model and Examples of its Applications

    Würth Elektronik Introduces LTspice Models for ESD Products

    Capacitor Ripple Current Testing: A Design Consideration

    TDK Releases 0201 High-Frequency Smallest Inductors

    Coilcraft Extends Air Core RF Inductors

    Bourns Releases Automotive 1W Flyback Transformer

    Wk 20 Electronics Supply Chain Digest

    Trending Tags

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    • Tantalum vs Ceramic
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    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

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Samsung Electro-Mechanics Releases High-Capacitance MLCCs for AI Server Applications

21.5.2025
Reading Time: 3 mins read
A A

Samsung Electro-Mechanics has developed two compact, high-capacitance MLCC ceramic capacitors: 0402, 47uF, X6S, 2.5V and 0603, 100uF, X6S, 2.5V to meet the specific needs of AI servers.

The structural design of AI servers involves stacking baseboards connected to multiple GPU Modules.

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Samsung Releases Worlds First 0603 X6S 22uF 10V MLCC for In-Vehicle Infotainment

As dozens of ASICs/GPUs are integrated into a single Rack, the generated heat increases, posing a challenge for effective heat dissipation. To address this, MLCCs with characteristics comparable to or exceeding those of X6S dielectric class are essential: Capacitance change rate of ±22% over a temperature range spanning -55℃ to 105℃.

In response to the increased MLCC requirements for AI servers, Samsung Electro-Mechanics has developed two compact, high-capacitance MLCCs: CL05X476MS6N9W# (0402 inch, 47uF, X6S, 2.5V) and CL10X107MS8NZW# (0603 inch, 100uF, X6S, 2.5V). These MLCCs, are designed to meet the specific needs of AI servers.

In the case of AI servers, their power consumption is significantly higher than that of conventional servers, requiring a substantial number of MLCCs to be mounted. However, the placement of MLCCs near the GPU limits the available mounting area. To address this challenge, adopting compact, high-capacitance MLCCs can optimize PCB design and enhance thermal management efficiency. 

Figure 1. Al Server GPU Module & Baseboard / Al Modular Server

Samsung Electro-Mechanics Compact High-Capacitance MLCCs for AI Servers

Additionally, incorporating the newly released MLCCs in AI servers can enhance the flexibility of designs and reduce ESL.  When three 0402 inch, 47uF (CL05X476MS8N9W#) MLCCs are applied to the same mounting area as one 0805 inch, 100uF MLCC, the mounting area is reduced, and ESL characteristics can also be improved as shown in Figure 2.

Figure 2. Advantages of High-Capacitance MLCCs in Terms of Space Efficiency and Performance

Specifications

Samsung MLCCSize(inch/mm)CapacitanceTCCRelated Voltage
CL05X476MS6N9W#0402/100547uFX6S2.5Vdc
CL10X107MS8NZW#0603/1608100uFX6S2.5Vdc

Related

Source: Samsung Electro-Mechanics

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