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    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

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Skeleton Technologies’ Ultracapacitor Chosen as Winner of Sustainable Solutions at TBB2019 in Paris

13.10.2019
Reading Time: 1 min read
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Source: Skeleton Technologies news

Skeleton Technologies CEO Taavi Madiberk pitched Skeleton Technologies to the top spot at The Business Booster 2019 in Paris on the 4th of October!

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

Samtec Expands Offering of Slim, High-Density HD Array Connectors

Skeleton Technologies’ Ultracapacitor Energy Storage Chosen as Winner out of 150+ Sustainable Solutions at TBB2019 in Paris.

TBB, a two-day international networking event organized yearly by InnoEnergy, showcased the best sustainable solutions to fight climate to high-level attendees from over 40 countries, and culminated at the award ceremony at the end of busy two days of thousands of meetings between energy industry representatives, financial communities, policy makers, and regulators.

The Business Booster is Europe’s catalyst for clean energy innovation and sustainability, and was organized for the seventh year running this year at the Palais des Congrès de Paris from 3-4 October 2019.

Attendees and speakers included for example Mary Robinson: Former President of Ireland, UN Special Envoy on Climate Change, Dr. Steven Chu: 12th United States Secretary of Energy, Nobel Prize – 1997 Physics, and Christel Heydemann: CEO Schneider Electric France.

 

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