Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Expands its Modular Contacts for Power-Dense Systems

    Murata to Decouple China Rare Earth Supply in 3 Years

    Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options

    Hirose Electric to Establish Automotive Connector Plant in India

    Schematic illustration of the electric double layer of porous carbon electrodes at elevated potentials in a a conventional electrolyte and b a weakly solvating electrolyte; source: authors

    Researchers Presented Lignin-based Electrolyte for 4V Supercapacitors with Low Self‑Discharge

    Samsung Outlines Growth Roadmap at its 52nd General Shareholders Meeting

    Samsung Electro-Mechanics Enters LEO Satellite Market With High‑Reliability MLCCs

    Vishay Introduced Space-Grade SMT Common Mode Choke

    Exxelia to Exhibit at APEC 2026 in San Antonio, Texas

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Expands its Modular Contacts for Power-Dense Systems

    Murata to Decouple China Rare Earth Supply in 3 Years

    Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options

    Hirose Electric to Establish Automotive Connector Plant in India

    Schematic illustration of the electric double layer of porous carbon electrodes at elevated potentials in a a conventional electrolyte and b a weakly solvating electrolyte; source: authors

    Researchers Presented Lignin-based Electrolyte for 4V Supercapacitors with Low Self‑Discharge

    Samsung Outlines Growth Roadmap at its 52nd General Shareholders Meeting

    Samsung Electro-Mechanics Enters LEO Satellite Market With High‑Reliability MLCCs

    Vishay Introduced Space-Grade SMT Common Mode Choke

    Exxelia to Exhibit at APEC 2026 in San Antonio, Texas

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Smoltek CNF-MIM Capacitors Hit 1,000x Lower Leakage

6.2.2026
Reading Time: 4 mins read
A A

Smoltek has reported a major reliability milestone for its CNF-MIM capacitors, demonstrating more than 1,000 times lower current leakage in a new 1,000‑hour operational life test at 85 °C and 2 V, with no observed degradations across the tested batch.

The latest DCL leakage current results confirm the robustness of the carbon nanofiber-based CNF-MIM wafer based capacitor technology for demanding high-performance computing and AI data center applications.

RelatedPosts

Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

Smolteks CNF MIM Capacitor Break 1 µF/mm²

Stronger Follow‑Up to Previous Reliability Test

The new long-term test follows an earlier 1,000‑hour reliability campaign completed in November 2025 on a previous CNF-MIM capacitor batch. In that earlier series, the capacitors showed minimal parameter drift over time but included a single early failure event. The latest 1,000‑hour operational life test on a subsequent batch now shows zero failures, with key electrical parameters remaining essentially unchanged from initial characterization.

According to Smoltek, the capacitors maintained their behavior throughout the full 1,000‑hour stress period at 85 °C and 2 V DC bias. The most striking improvement versus the previous campaign is the more than 1,000x reduction in leakage current, which translates into significantly higher insulation resistance at rated voltage.

Ultra‑Low Leakage and Insulation Resistance

The new CNF-MIM capacitors exhibit an insulation resistance on the order of 1,000 GΩ at 2 V DC, corresponding to a leakage current of only about 2 pA at rated voltage. This ultra‑low leakage is achieved while preserving high capacitance density and low ESR, and with no measurable drifts after the full 1,000‑hour life test.

By dramatically reducing leakage, Smoltek’s CNF-MIM technology minimizes continuous electrical stress and parasitic heat generation in operation. This directly supports improved long‑term stability of electronic systems, lowers the risk of field failures over product lifetime, and contributes to overall energy efficiency at the system level.

The combination of high capacitance density, very low ESR equivalent series resistance and extremely low leakage is particularly attractive for high‑performance computing and AI accelerator platforms. In these applications, dense decoupling close to advanced processors is critical to maintain power integrity under fast, high-current transients.

Lower leakage current not only reduces power losses but also helps to keep local temperatures down in densely packed modules and boards. For large AI data centers and HPC clusters, this can translate into more stable long‑term performance, fewer service interventions, and lower cooling and energy costs over time. Smoltek reports that these factors are increasingly important in discussions with potential industrial partners evaluating next‑generation capacitor technologies.

Key Electrical Performance Data

In the reported life test, the CNF-MIM capacitors were fully characterized before and after the 1,000‑hour operation, with no significant changes found in any of the primary figures of merit. The summarized electrical data are:

  • Capacitance density: 170 nF/mm², unchanged after the 1,000‑hour life test.
  • Equivalent Series Resistance (ESR): approximately 1,500 mΩ, unchanged after test completion.
  • Insulation resistance: 1,000 GΩ at 2 V DC, corresponding to about 2 pA leakage current, again with no measurable degradation after the life test.

These results support Smoltek’s positioning of CNF-MIM as a high‑reliability capacitor technology suitable for advanced semiconductor packaging, 2.5D/3D integration and other space‑constrained applications that demand both high performance and long service life.

External Life Test in Progress

In parallel with the internal qualification work, Smoltek has initiated an external operational life test of CNF-MIM capacitors at an independent test house. The external campaign is expected to be completed by mid‑February 2026, with results anticipated to further validate the internal findings.

Smoltek expects that successful third‑party verification of the technology’s stability and leakage performance will strengthen ongoing dialogues with semiconductor and system-level partners. This external confirmation is an important step toward broader industrial adoption of CNF-MIM capacitors in future high‑density power distribution networks and advanced packaging platforms.

Source

This article is based on information provided by Smoltek in its official news and press release communication about CNF-MIM capacitors and their latest 1,000‑hour life test results.

References

  1. Smoltek news – CNF-MIM Capacitors Demonstrate 1,000x Lower Current Leakage in Life Test
  2. Smoltek press release – CNF-MIM capacitors demonstrate 1,000x lower current leakage in a new life test
  3. Earlier Smoltek news – CNF-MIM capacitors pass 1,000 hours of reliability test

Related

Recent Posts

Murata to Decouple China Rare Earth Supply in 3 Years

19.3.2026
7
Schematic illustration of the electric double layer of porous carbon electrodes at elevated potentials in a a conventional electrolyte and b a weakly solvating electrolyte; source: authors

Researchers Presented Lignin-based Electrolyte for 4V Supercapacitors with Low Self‑Discharge

19.3.2026
3

Samsung Outlines Growth Roadmap at its 52nd General Shareholders Meeting

19.3.2026
2

Samsung Electro-Mechanics Enters LEO Satellite Market With High‑Reliability MLCCs

19.3.2026
4

Exxelia to Exhibit at APEC 2026 in San Antonio, Texas

17.3.2026
26

ESA SPCD 26 Call for Papers Extended to 30th March

16.3.2026
80

Peak Nano to Develop Fusion Grade High Energy Film Capacitors

11.3.2026
35

Panasonic Expands Automotive PP Film Capacitors Voltage Range

9.3.2026
29

February 2026 Interconnect, Passives and Electromechanical Components Market Insights

9.3.2026
75

Upcoming Events

Mar 21
All day

PSMA Capacitor Workshop 2026

Mar 24
9:00 - 10:00 CET

Power protection in the digital age – eFuse and hot-swap strategies for modern data center design

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version