Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces C0G Flexible Termination Automotive MLCCs

    SCHURTER Releases SMT Micro Switch for Compact HMIs

    binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

    Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

    Murata Introduces Crystal and NTC Set for Automotive UWB Timing

    Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

    Modeling Fringing Field Losses in Inductors & Transformers

    YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

    Littelfuse Expands High-Voltage TVS Diodes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    YAGEO Introduces C0G Flexible Termination Automotive MLCCs

    SCHURTER Releases SMT Micro Switch for Compact HMIs

    binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability

    Vishay Introduced Thin Film Submount Platform for Optical and RF Modules

    Murata Introduces Crystal and NTC Set for Automotive UWB Timing

    Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages

    Modeling Fringing Field Losses in Inductors & Transformers

    YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

    Littelfuse Expands High-Voltage TVS Diodes

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Modeling Fringing Field Losses in Inductors & Transformers

    Why Power Inductors Use a Ferrite Core With an Air Gap

    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Smoltek Semi and YAGEO Group Sign Joint Development Agreement to Commercialize Discrete Capacitors

18.8.2022
Reading Time: 2 mins read
A A

Smoltek Nanotech Holding AB (“Smoltek”) announces that the group company Smoltek Semi AB (“Smoltek Semi”) has entered into a Joint Development Agreement (JDA) with a subsidiary of YAGEO Group (“YAGEO”), a global electronic component company, to commercialize a silicon based Carbon Nanofiber (CNF) discrete capacitor.

The capacitors are based on Smoltek’s patented CNF-MIM technology and will be fabricated using a proprietary nano-fiber synthesis machine and industrial silicon foundry processes.

RelatedPosts

Smoltek CNF-MIM Capacitors Hit 1,000x Lower Leakage

Smoltek CNF-MIM Capacitors Pass 1,000h Reliability Test

Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

The initial target application is a decoupling capacitor for microprocessor landside mounting. The target thickness for this discrete capacitor is 40 microns. Landside decoupling for microprocessors is an increasing area of interest for miniaturization within the semiconductor industry.

The JDA constitutes the next step in accordance with the Memorandum of Understanding (MoU) previously signed by the parties. In conjunction with the signing of the JDA, Smoltek Semi will receive 1.5 MUSD to be used for development activities within the framework of the partnership with YAGEO.

Dr. Philip Lessner, Senior Vice President of YAGEO Group states, “This partnership is an excellent opportunity to commercialize a new technology that will be used in capacitors for applications where space is at a premium and high capacitance density is required”.

Håkan Persson, CEO of Smoltek Nanotech Holding says, “We are excited to partner with a major passive component manufacturer to commercialize a product that is based on our core Carbon Nanofiber technology. We now have a perfect partner in place to complete a competitive product and industrial mass production process for our ultra-thin CNF-MIM capacitors”.

Related

Source: Smoltek

Recent Posts

YAGEO Introduces C0G Flexible Termination Automotive MLCCs

30.4.2026
7

YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs

29.4.2026
37

Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating

27.4.2026
32

Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%

27.4.2026
48

Exxelia Introduces SMD High‑Voltage Mica Capacitors

28.4.2026
23

Modelithics Releases COMPLETE v26.1 for Keysight ADS

23.4.2026
13

April 2026 Interconnect, Passives and Electromechanical Components Market Insights

22.4.2026
81

KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors

21.4.2026
48

When More Capacitance Hurts Reliability: The Role of the Metallic Skeleton in Tantalum Anodes

20.4.2026
47

Upcoming Events

May 5
16:00 - 17:00 CEST

Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends

May 7
17:00 - 18:00 CEST

From Grid to Motion: How Industrial Electrification is Redefining Power System Design

May 12
8:00 - 15:00 CEST

ESCC Space Splice connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version