Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Extends Automotive TO-220 Thick Film Power Resistors with 30W Option

    Transient Suppression Guide

    Rubycon Releases High Capacitance Radial Lead Aluminum Electrolytic Capacitors

    October 2025 ECIA US Components Sales Sentiment Remains Strong but Weakens in November

    Wk 46 Electronics Supply Chain Digest

    Overvoltage and Transient Protection for DC/DC Power Modules

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

    Skeleton Opens SuperBattery Factory in Finland 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Vishay Extends Automotive TO-220 Thick Film Power Resistors with 30W Option

    Transient Suppression Guide

    Rubycon Releases High Capacitance Radial Lead Aluminum Electrolytic Capacitors

    October 2025 ECIA US Components Sales Sentiment Remains Strong but Weakens in November

    Wk 46 Electronics Supply Chain Digest

    Overvoltage and Transient Protection for DC/DC Power Modules

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Littelfuse Releases TMR Switches with Ultra-Low Power Magnetic Sensing

    Skeleton Opens SuperBattery Factory in Finland 

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TAIYO YUDEN Expands Multilayer Chip Metal Power Inductors for Smartphones and Wearable Devices

5.8.2024
Reading Time: 4 mins read
A A

TAIYO YUDEN expands lineup of Multilayer Chip Metal Power Inductors for smartphones featuring 20% improvement in DC superposition characteristics and 10% reduction in DC resistance compared to previous models.

TAIYO YUDEN CO., LTD. has begun mass production of three products, including the LSCND1412FETR47ME (1.4 x 1.2 x 0.65 mm; maximum height shown), in its MCOIL™ LSCN series of multilayer metal power inductors.

RelatedPosts

TAIYO YUDEN Releases 22uF MLCC in 0402 Size for AI Servers

TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

TAIYO YUDEN Releases 0.33mm Thin SMD Metal Power Inductor

These power inductors are for use as choke coils in the power circuits of smartphones. Retaining the same form factor as our previous product “LSCND1412FETR47MC” (1.4 x 1.2 x 0.65 mm), the DC superposition allowable current of our new “LSCND1412FETR47ME” has been increased by 20% to 3.6 A
(previously 3.0 A), and its DC resistance has been reduced by 10% to 38 mΩ (previously 42 mΩ). These improvements contribute to boosting the performance of power supply circuits in smartphones, which are becoming increasingly sophisticated and multifunctional.

TAIYO YUDEN CO., LTD. has also begun mass production of two sizes and two products in the MCOIL™ LSCN series of multilayer metal power inductors, including the “LSCND1006HKT2R2MF” (1.0 x 0.6 x 0.8 mm; maximum height shown). These power inductors are for use as choke coils in the power supply circuits of wearable devices such as TWS devices and smart watches, which require ultra-compact size and high performance. The “LSCND1006HKT2R2MF” is approximately 50% smaller in volume than our previous product, the “LSCNB1608HKT2R2MD” (1.6 x 0.8 x 0.8 mm), and contributes to the miniaturization of these devices. Mass production of these products commenced in May 2024 at our subsidiary WAKAYAMA TAIYO YUDEN (Inami-cho, Hidaka-gun, Wakayama Prefecture, Japan). Samples are available for 50 yen per unit.

Technology Background

Smartphones

Smartphones are becoming increasingly sophisticated, with capabilities such as AI-based image and video editing, as well as voice and text translation. At the same time, there is demand for greater efficiency in order to keep their body small, and achieve long operating times with limited battery capacity. To achieve both high performance and high efficiency, a smartphone’s processor operates at high speeds with low voltage and high current, and employs a multi-core configuration where each core is equipped with its own power supply circuit, allowing it to improve both its processing power and efficiency by switching the cores used depending on load. This trend in power supply circuits has become particularly pronounced in cutting-edge smartphones, which require both high performance and high efficiency, and in recent years has led to an increase in the adoption of small and thin low-inductance power inductors capable of handling large currents.

To address these needs, at TAIYO YUDEN we have been using metallic magnetic materials with high DC superposition characteristics to optimize the design and other aspects of our MCOIL™ LSCN series multilayer metal power inductors—which have the advantage of allowing them to be made more compact and
thinner—commercializing three products, including “LSCND1412FETR47ME,” which deliver 20% greater DC superposition allowable current and 10% smaller DC resistance compared to our previous products. In response to market needs, we will continue to expand and improve our product lineup with higher
functionality and reliability, as well as smaller and thinner products.

Application
For use as a choke coil for power circuits in smartphones and other devices.

Wearable devices

Wearable devices need to be compact, deliver high performance, and operate for long periods of time. In particular, TWS devices require enhanced functionality, such as noise canceling, support for high-resolution audio, and advanced sensors for detecting when the earphone is worn or taken off, as well as acquiring location information. For this reason, power supply circuits must be both compact and highly efficient, and these circuits require compact and high-inductance power inductors that are capable of handling large currents, while also having low DC resistance.

To address these needs, at TAIYO YUDEN we have been using metallic magnetic materials with high DC superposition characteristics to expand our lineup of MCOIL™ LSCN series of multilayer metal power inductors which have the advantage of allowing them to be made more compact and thinner. With our latest
upgrade, we have commercialized the “LSCND1006HKT2R2MF,” which has a volume approximately 50% smaller than our previous product, the “LSCNB1608HKT2R2MD” (1.6 x 0.8 x 0.8 mm), while maintaining a DC superposition allowable current of 0.8 A and achieving a low DC resistance of 375 mΩ.
In response to market needs, we will continue to expand and improve our product lineup with higher functionality and reliability, as well as smaller and thinner products.

Application
For use as a choke coil for power circuits in wearable devices such as TWS devices and smart watches.

Related

Source: Taiyo Yuden

Recent Posts

October 2025 ECIA US Components Sales Sentiment Remains Strong but Weakens in November

18.11.2025
12

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

10.11.2025
64

Transformer Safety IEC 61558 Standard

7.11.2025
41

3-Phase EMI Filter Design, Simulation, Calculation and Test

6.11.2025
104

Coilcraft Introduces Ultra-Low Loss Shielded Power Inductors

6.11.2025
30

Exxelia Presents Smart Integrated Magnetics Solution at Space Tech Expo 2025 

5.11.2025
23

Murata Expands High Cutoff Frequency Chip Common Mode Chokes

5.11.2025
18

Transformer Design Optimization for Power Electronics Applications

4.11.2025
33

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

31.10.2025
43

Upcoming Events

Dec 2
December 2 @ 12:00 - December 4 @ 14:15 CET

Microwave Packaging Technology

Dec 9
December 9 @ 12:00 - December 11 @ 14:15 EST

Space and Military Standards for Hybrids and RF Microwave Modules

Dec 10
16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version