Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

    High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

    Bourns Introduced Automotive TVS Diodes for Compact ESD Protection

    EMC‑Compliant PCB and Connector Design Guidelines

    Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

    Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

    Bourns Releases Automotive Gate Driver Transformer for Isolated Power

    Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

    Knowles Expands High‑Q Ceramic Core Inductors for RF designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TAIYO YUDEN Expands Multilayer Chip Metal Power Inductors for Smartphones and Wearable Devices

5.8.2024
Reading Time: 4 mins read
A A

TAIYO YUDEN expands lineup of Multilayer Chip Metal Power Inductors for smartphones featuring 20% improvement in DC superposition characteristics and 10% reduction in DC resistance compared to previous models.

TAIYO YUDEN CO., LTD. has begun mass production of three products, including the LSCND1412FETR47ME (1.4 x 1.2 x 0.65 mm; maximum height shown), in its MCOIL™ LSCN series of multilayer metal power inductors.

RelatedPosts

TAIYO YUDEN Releases 220uF 1210 Automotive MLCC

TAIYO YUDEN Releases Mini Metal Power Inductors

Conductive Polymer Capacitor Market and Design‑In Guide to 2035

These power inductors are for use as choke coils in the power circuits of smartphones. Retaining the same form factor as our previous product “LSCND1412FETR47MC” (1.4 x 1.2 x 0.65 mm), the DC superposition allowable current of our new “LSCND1412FETR47ME” has been increased by 20% to 3.6 A
(previously 3.0 A), and its DC resistance has been reduced by 10% to 38 mΩ (previously 42 mΩ). These improvements contribute to boosting the performance of power supply circuits in smartphones, which are becoming increasingly sophisticated and multifunctional.

TAIYO YUDEN CO., LTD. has also begun mass production of two sizes and two products in the MCOIL™ LSCN series of multilayer metal power inductors, including the “LSCND1006HKT2R2MF” (1.0 x 0.6 x 0.8 mm; maximum height shown). These power inductors are for use as choke coils in the power supply circuits of wearable devices such as TWS devices and smart watches, which require ultra-compact size and high performance. The “LSCND1006HKT2R2MF” is approximately 50% smaller in volume than our previous product, the “LSCNB1608HKT2R2MD” (1.6 x 0.8 x 0.8 mm), and contributes to the miniaturization of these devices. Mass production of these products commenced in May 2024 at our subsidiary WAKAYAMA TAIYO YUDEN (Inami-cho, Hidaka-gun, Wakayama Prefecture, Japan). Samples are available for 50 yen per unit.

Technology Background

Smartphones

Smartphones are becoming increasingly sophisticated, with capabilities such as AI-based image and video editing, as well as voice and text translation. At the same time, there is demand for greater efficiency in order to keep their body small, and achieve long operating times with limited battery capacity. To achieve both high performance and high efficiency, a smartphone’s processor operates at high speeds with low voltage and high current, and employs a multi-core configuration where each core is equipped with its own power supply circuit, allowing it to improve both its processing power and efficiency by switching the cores used depending on load. This trend in power supply circuits has become particularly pronounced in cutting-edge smartphones, which require both high performance and high efficiency, and in recent years has led to an increase in the adoption of small and thin low-inductance power inductors capable of handling large currents.

To address these needs, at TAIYO YUDEN we have been using metallic magnetic materials with high DC superposition characteristics to optimize the design and other aspects of our MCOIL™ LSCN series multilayer metal power inductors—which have the advantage of allowing them to be made more compact and
thinner—commercializing three products, including “LSCND1412FETR47ME,” which deliver 20% greater DC superposition allowable current and 10% smaller DC resistance compared to our previous products. In response to market needs, we will continue to expand and improve our product lineup with higher
functionality and reliability, as well as smaller and thinner products.

Application
For use as a choke coil for power circuits in smartphones and other devices.

Wearable devices

Wearable devices need to be compact, deliver high performance, and operate for long periods of time. In particular, TWS devices require enhanced functionality, such as noise canceling, support for high-resolution audio, and advanced sensors for detecting when the earphone is worn or taken off, as well as acquiring location information. For this reason, power supply circuits must be both compact and highly efficient, and these circuits require compact and high-inductance power inductors that are capable of handling large currents, while also having low DC resistance.

To address these needs, at TAIYO YUDEN we have been using metallic magnetic materials with high DC superposition characteristics to expand our lineup of MCOIL™ LSCN series of multilayer metal power inductors which have the advantage of allowing them to be made more compact and thinner. With our latest
upgrade, we have commercialized the “LSCND1006HKT2R2MF,” which has a volume approximately 50% smaller than our previous product, the “LSCNB1608HKT2R2MD” (1.6 x 0.8 x 0.8 mm), while maintaining a DC superposition allowable current of 0.8 A and achieving a low DC resistance of 375 mΩ.
In response to market needs, we will continue to expand and improve our product lineup with higher functionality and reliability, as well as smaller and thinner products.

Application
For use as a choke coil for power circuits in wearable devices such as TWS devices and smart watches.

Related

Source: Taiyo Yuden

Recent Posts

Würth Elektronik Expands Nanocrystalline Cable Cores for Broadband EMI Suppression

23.6.2026
4

Bourns Releases Automotive Gate Driver Transformer for Isolated Power

22.6.2026
17

Vishay Unveils 1.5 kV IHDV High Voltage Power Inductors for EV and Industrial Converters

19.6.2026
27

DMASS: European Components Distribution Returns To Growth In Q1 2026

16.6.2026
58

German Component Distribution Market Rebounds in Q1 2026 According to FBDi

16.6.2026
39

Sumida Introduces SMD Metal Inductors for High‑Current Automotive DC/DC Converters

15.6.2026
29

Knowles Expands High Q Ceramic Core Inductors

11.6.2026
37

Vishay Extends Automotive Ferrite Beads for High‑Current EMC Noise Filtering

10.6.2026
39

Modelithics Releases COMPLETE Library v26.2 for Keysight Genesys

8.6.2026
24

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

Jul 21
16:00 - 17:00 CEST

Safety by design: X and Y Interference suppression capacitors for power line filters

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version