Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TAIYO YUDEN Releases 0.33mm Thin SMD Metal Power Inductor

7.1.2025
Reading Time: 3 mins read
A A

TAIYO YUDEN has begun mass production of a SMD metal power inductor MCOIL™ LSCN series of multilayer thin metal power inductors in dimensions 1.0 x 0.5 x 0.33 mm maximum height.

This power inductor is for use as choke coils in the power supply circuits of wearable devices, such as smartphones, AR/VR glasses, TWS devices, and smart watches. 

RelatedPosts

TAIYO YUDEN Introduced Hybrid Aluminum Capacitors for 48V Automotive Power Supplies

TAIYO YUDEN Releases 220uF 1210 Automotive MLCC

TAIYO YUDEN Releases Mini Metal Power Inductors

The “LSCND1005CCTR47MH” is 40% lower in height than our previous product, the “LSCNB1005EETR47MB” (1.0 x 0.5 x 0.55 mm), and realizes a metal power inductor as thin as 0.33 mm. This will contribute to the miniaturization and thickness reduction of cutting-edge electronic devices.

Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2024. Samples are available for 50 yen per unit.

Technology Background
As smartphones, AR/VR glasses, and wearable devices are equipped with higher-performance processors, more sensors, multiple cameras, and higher-capacity batteries for sophistication, electronic components used in them need to be smaller and thinner.

In particular, smartphones are requiring thinner electronic components, due to the trend towards foldable devices that combine large screens and smaller sizes, as well as the adoption of multi-layered circuit boards. On the other hand, wearable devices, such as AR/VR glasses, TWS devices, and smart watches, require smaller, lighter, and thinner components to achieve a thin profile and comfortable fit.

To address these needs, TAIYO YUDEN has been expanding its lineup in the MCOIL™ LSCN series of multilayer metal power inductors which use metallic magnetic core materials with high DC saturation characteristics, and provide superior characteristics for achieving miniaturization and thinness. With our latest upgrade, we have commercialized the “LSCND1005CCTR47MH,” which achieves a thickness of 0.33 mm for a metal power inductor by utilizing the strengths of our multilayer process technology.

In response to market needs, we will continue to expand and improve our product lineup with higher performance and reliability.

■ Application
For use as choke coils for power supply circuits in wearable devices such as smartphones, AR/VR glasses, TWS devices, and smart watches.

■ Characteristics

Part numberSize
(LxW)
[mm]
H
[mm]
max.
Nominal
inductance
[μH]
Inductance
tolerance
[%]
Rated current*3 [A] max.DC
resistance
[mΩ] max.
Saturation
current
Idc1*1
Temperature
rise current
Idc2*2
LSCND1005CCTR47MH1.0×0.50.330.47±20%1.40.8345
  • *1 The saturation current value (Idc1) is the DC current value having an inductance decrease down to 30%. (at 20℃)
  • *2 The temperature rise current value(Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)
  • *3 The rated current value is following either Idc1(max) or Idc2(max), which is the lower one.

Related

Source: TAIYO YUDEN

Recent Posts

Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

15.10.2026
18
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
37
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
12
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
46
YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

2.10.2026
41
Bourns CRT-TN TaN thin-film chip resistors in 0402, 0603, 0805 and 1206 package sizes

Bourns Releases TaN Thin Film Resistors Target Precision Circuits

1.10.2026
23
Würth Elektronik electronica 2026 presentation featuring electronic components, PCB technologies and high-current PowerBusbar connection solutions.

Würth Elektronik Previews Components, PCBs and Power Solutions at electronica 2026

30.9.2026
29
Bourns SRP201210V low-profile shielded SMD power inductors for compact portable electronics

Bourns Releases Compact Shielded Power Inductors

30.9.2026
24
TDK and TAIYO YUDEN business alliance announcement for advanced MLCCs and inductors supporting AI infrastructure.

TDK and TAIYO YUDEN Explore Alliance for MLCCs and Inductors

29.9.2026
145

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved