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    Bourns Extends Current Sense Resistors for High-Current Power Designs with 0.1 mΩ, 15 W

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    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

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    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

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    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

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    Bourns Extends Current Sense Resistors for High-Current Power Designs with 0.1 mΩ, 15 W

    KYOCERA AVX Releases Vibration-Proof SMD Aluminum Electrolytic Capacitors for Harsh Industrial Designs

    Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

    YAGEO Adds X8 Flexible-Termination Automotive MLCCs for 150°C Designs

    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Vishay Releases High-Power Thick Film Resistors for Compact Power Modules

    Wk 32 Electronics Supply Chain Digest

    Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

    Advanced Electronics Markets Reshape Capacitor Demand for 2026/2027

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
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  • Video
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    Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

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TDK Develops Industry’s First High-Reliability EMC Suppression Chip Beads for Automotive

29.9.2021
Reading Time: 2 mins read
A A

TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.

This series marks the industry’s first* high-reliability chip bead specifically designed for automotive applications associated with engine control modules (ECM), anti-lock brake systems (ABS), electric power steering (EPS), electric and hybrid electric vehicles (EV/EHV), inverters and LED headlights.

RelatedPosts

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TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

TDK Releases Compact SMD Gate Drive Transformers for xEV

In high-temperature automotive environments, such as engine compartments, high-durability solder is increasingly used to prevent solder cracks in the bonds between chip components and the mounting substrate. Since high-durability solders do not stretch easily and impart higher stress compared with conventional solders, they place a large load on chip components and do not meet the reliability requirements of existing chip beads. With improvements to the terminal electrode material and plating process, the MMZ1608-HE series improves the bonding strength between the terminal electrode and plating, making it ideal for use with high-durability solder in 150 ℃ environments.

The four products in the series have a rated current max ranging from 200 to 300 at 150 ℃, DC resistance max between 0.15 to 0.5, and impedance from 120-1000, respectively.

TDK will continue to expand its lineup of compact sizes and various impedances to support a wide range of automotive specifications and designs.

* Source: TDK, as of September 2021

Main applications

  • Automotive electrical control chips on which high-durability solder is expected to be used, including ECM, ABS, EPS, EV-EHV, inverters and LED headlights

Main features and benefits

  • Compatible with high durability soldering in 150 ℃ environments

Key data

Related

Source: TDK

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