Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    October 2025 Interconnect, Passives and Electromechanical Components Market Insights

    Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

    Wk 43 Electronics Supply Chain Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    October 2025 Interconnect, Passives and Electromechanical Components Market Insights

    Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

    Wk 43 Electronics Supply Chain Digest

    Samsung Releases Automotive Molded 2220 1kV C0G MLCC

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    VINATech Offers Smallest 100µF Al-Hybrid Capacitor

    Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

    Power Inductors Future: Minimal Losses and Compact Designs

    Bourns Unveils Automotive 3 Watt Gate Driver Transformer

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

    Ripple Steering in Coupled Inductors: SEPIC Case

    SEPIC Converter with Coupled and Uncoupled Inductors

    Coupled Inductors in SEPIC versus Flyback Converters

    Non-Linear MLCC Class II Capacitor Measurements Challenges

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TT Electronics introduces Thermal Jumper Chip for enhanced temperature rise management

11.11.2019
Reading Time: 1 min read
A A

Source: TT Electronics news

Woking, UK, April 24, 2019 – TT Electronics, a global provider of engineered electronics for performance critical applications, today announced the introduction of the TJC series thermal jumper chips, enabling circuit designers to manage temperature rise in compact power electronic assemblies.

RelatedPosts

October 2025 Interconnect, Passives and Electromechanical Components Market Insights

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

Wk 43 Electronics Supply Chain Digest

These parts provide a thermally conductive pathway with electrical isolation for management of PCB hotspot areas. Aluminium nitride, which has nearly five times the thermal conductivity of alumina, is employed in the thermal jumper chip to keep compact electronic assemblies cooler which enhances product reliability.

“There is a growing demand for compact high power assemblies that require board-level thermal management,” said Stephen Oxley, Senior Resistors Engineer, Applications and Marketing, TT Electronics. “TT is the only global resistor manufacturer offering this technology to tackle thermal instability in high power density designs.”

The TJC series boasts greater thermal conductivity than the equivalent footprint of 70µ copper, and therefore gives better thermal connection than an uninterrupted trace. The component’s compact mass and design (available in a case size as small as 0603) minimises PCB area and total assembly size and weight. These features are particularly suitable for power supplies, power amplifiers, RF amplifiers, and high power laser diode applications that may be found in the aerospace, medical, and industrial markets.

Related

Recent Posts

Exxelia 4-Terminal Safety Capacitors Compliant with NF F 62-102 Railway Standard

27.10.2025
17

VINATech Offers Smallest 100µF Al-Hybrid Capacitor

23.10.2025
33

Vishay Unveils SMD 1200V PTC Thermistors in Compact Size

23.10.2025
9

Bourns Unveils Automotive 3 Watt Gate Driver Transformer

22.10.2025
8

Stackpole Introduces Automotive Thick Film Wide Termination Chip Resistors

20.10.2025
19

September 2025 ECIA US Components Sales Sentiment Continues in Optimism

20.10.2025
21

Bourns Release Automotive 4-Terminal Shunt Resistors

17.10.2025
23

Bourns Releases High Inductance Common Mode Choke

16.10.2025
22

Vishay Releases Automotive TO-220 Case 50W Thick Film Power Resistor

16.10.2025
18

High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design

15.10.2025
27

Upcoming Events

Oct 30
11:00 - 12:00 CET

Space Ceramic Capacitors with Flexible Testing

Nov 4
10:00 - 11:00 PST

Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

Nov 4
November 4 @ 12:00 - November 6 @ 14:15 EST

Wirebond Materials, Processes, Reliability and Testing

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version